A Novel Approach to Low Profile Heat Sink Design

2010 ◽  
Vol 132 (9) ◽  
Author(s):  
Jason Stafford ◽  
Ed Walsh ◽  
Vanessa Egan ◽  
Pat Walsh ◽  
Yuri S. Muzychka
Keyword(s):  
Forced Convection ◽  
Heat Sink ◽  
Theoretical Study ◽  
Convection Heat Transfer ◽  
Transfer Rates ◽  
Novel Approach ◽  
Low Profile ◽  
Small Footprint ◽  
Convection Cooling ◽  
Heat Sink Design

This paper discusses the importance of developing cooling solutions for low profile devices. This is addressed with an experimental and theoretical study on forced convection cooling solution designs that could be implemented into such devices. Conventional finned and corresponding finless designs of equal exterior dimensions are considered for three different heat sink profiles ranging from 1 mm to 4 mm in combination with a commercially available radial blower. The results show that forced convection heat transfer rates can be enhanced by up to 55% using finless designs at low profiles with relatively small footprint areas. Overall, this paper provides optimization and geometry selection criteria, which are relevant to designers of low profile cooling solutions.

An Experimental and Theoretical Study of Finned and Finless Heat Sinks for Low Profile Applications

2009 ◽  
Author(s):  
Jason Stafford ◽  
Ed Walsh ◽  
Vanessa Egan ◽  
Pat Walsh ◽  
Yuri S. Muzychka
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heat Sink ◽  
Theoretical Study ◽  
Convection Heat Transfer ◽  
Heat Sinks ◽  
Duct Flow ◽  
Transfer Rates ◽  
Low Profile ◽  
Small Footprint

This paper discusses the importance of developing cooling solutions for low profile devices. This is addressed with an experimental and theoretical study on forced convection cooling solution designs that could be implemented into such devices. Conventional finned and corresponding finless designs of equal exterior dimensions are considered for three different heat sink profiles ranging from 1mm to 4mm profile in combination with a commercially available radial blower. The results show that forced convection heat transfer rates can be enhanced by up to 55% using finless designs at low profiles with relatively small footprint areas. The advantages of both finned and finless geometries are presented along with the limitations of the customary finned heat sink design at low profile scales. The results also show large increases in heat transfer rates over that predicted which can be attained at the low profile scale based on geometry selection. Dimensionless comparisons are made between experimental results and combined hydrodynamic and thermally developing duct flow theory which is representative of the flow regime within both the finned and finless geometries. Overall, this paper provides optimization and geometry selection criteria which are relevant to designers of low profile cooling solutions.

A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks

1990 ◽  
Vol 112 (3) ◽  
pp. 234-240 ◽  
Author(s):  
G. L. Lehmann ◽  
S. J. Kosteva
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heat Sink ◽  
Convection Heat Transfer ◽  
Heat Sinks ◽  
Air Cooling ◽  
Transfer Coefficients ◽  
Packaging System ◽  
Transfer Rates ◽  
Heat Transfer Coefficients

An experimental study of forced convection heat transfer is reported. Direct air cooling of an electronics packaging system is modeled by a channel flow, with an array of uniformly sized and spaced elements attached to one channel wall. The presence of a single or complete row of longitudinally finned heat sinks creates a modified flow pattern. Convective heat transfer rates at downstream positions are measured and compared to that of a plain array (no heat sinks). Heat transfer rates are described in terms of adiabatic heat transfer coefficients and thermal wake functions. Empirical correlations are presented for both variations in Reynolds number (5000 < Re < 20,000) and heat sink geometry. It is found that the presence of a heat sink can both enhance and degrade the heat transfer coefficient at downstream locations, depending on the relative position.

The Development of an Integrated Fan and Heat Sink Solution for Thermal Management in Low Profile Applications

2006 ◽  
Author(s):  
Ed Walsh ◽  
Ronan Grimes
Keyword(s):  
Heat Flux ◽  
Thermal Management ◽  
Heat Sink ◽  
Heat Sinks ◽  
Portable Electronics ◽  
Low Profile ◽  
Convection Cooling ◽  
New Methodologies ◽  
Heat Sink Design ◽  
Management Issues

The increasing heat flux densities from portable electronics are leading to new methodologies being implemented to provide thermal management within such devices. Many technologies are under development to transport heat within electronic equipment to allow it to be transported into the surroundings via conduction, natural convection and radiation. Few have considered the approach of implementing a forced convection cooling solution in such devices. This work addresses the potential of a low profile integrated fan and heat sink solution to electronics thermal management issues of the future, particularly focusing upon possible solutions in low profile portable electronics. We investigate two heat sink designs with mini channel features, applicable to low profile applications. The thermal performance of the heat sinks is seen to differ by approximately 40% and highlights the importance of efficient heat sink design at this scale.

Energy Efficient Heat Sink Design: Natural Versus Forced Convection Cooling

2017 ◽  
Vol 32 (11) ◽  
pp. 8693-8704 ◽  
Author(s):  
Daniel Christen ◽  
Milos Stojadinovic ◽  
Juergen Biela
Keyword(s):  
Forced Convection ◽  
Heat Sink ◽  
Energy Efficient ◽  
Convection Cooling ◽  
Heat Sink Design

scholarly journals Erratum: “A Novel Approach to Low Profile Heat Sink Design” [Journal of Heat Transfer, 2010, 132(9), p. 091401]

2010 ◽  
Vol 132 (12) ◽  
Author(s):  
J. Stafford ◽  
E. Walsh ◽  
V. Egan ◽  
P. Walsh ◽  
Y. S. Muzychka
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Novel Approach ◽  
Low Profile ◽  
Heat Sink Design

scholarly journals A Numerical and Experimental Study of a Novel Heat Sink Design for Natural Convection Cooling of LED Grow Lights

Energies ◽  
2020 ◽  
Vol 13 (16) ◽  
pp. 4046
Author(s):  
Ram Adhikari ◽  
Dawood Beyragh ◽  
Majid Pahlevani ◽  
David Wood
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Heat Sink ◽  
Large Scale ◽  
High Efficiency ◽  
Experimental Testing ◽  
Growth Stages ◽  
Air Cooling ◽  
Convection Cooling ◽  
Heat Sink Design

Light-emitting diode (LED) grow lights are increasingly used in large-scale indoor farming to provide controlled light intensity and spectrum to maximize photosynthesis at various growth stages of plants. As well as converting electricity into light, the LED chips generate heat, so the boards must be properly cooled to maintain the high efficiency and reliability of the LED chips. Currently, LED grow lights are cooled by forced convection air cooling, the fans of which are often the points of failure and also consumers of a significant amount of power. Natural convection cooling is promising as it does not require any moving parts, but one major design challenge is to improve its relatively low heat transfer rate. This paper presents a novel heat sink design for natural convection cooling of LED grow lights. The new design consists of a large rectangular fin array with openings in the base transverse to the fins to increase air flow, and hence the heat transfer. Numerical simulations and experimental testing of a prototype LED grow light with the new heat sink showed that openings achieved their intended purpose. It was found that the new heat sink can transfer the necessary heat flux within the safe operating temperature range of LED chips, which is adequate for cooling LED grow lights.

Thermal Analysis of Miniature Low Profile Heat Sinks With and Without Fins

2009 ◽  
Vol 131 (3) ◽  
Author(s):  
V. Egan ◽  
P. A. Walsh ◽  
E. Walsh ◽  
R. Grimes
Keyword(s):  
Heat Transfer ◽  
Heat Sink ◽  
Volume Flow Rate ◽  
Electronic Devices ◽  
Heat Fluxes ◽  
Heat Sinks ◽  
Superior Performance ◽  
Low Profile ◽  
In Series ◽  
Heat Sink Design

Reliable and efficient cooling solutions for portable electronic devices are now at the forefront of research due to consumer demand for manufacturers to downscale existing technologies. To achieve this, the power consumed has to be dissipated over smaller areas resulting in elevated heat fluxes. With regard to cooling such devices, the most popular choice is to integrate a fan driven heat sink, which for portable electronic devices must have a low profile. This paper presents an experimental investigation into such low profile cooling solutions, which incorporate one of the smallest commercially available fans in series with two different heat sink designs. The first of these is the conventionally used finned heat sink design, which was specifically optimized and custom manufactured in the current study to complement the driving fan. While the second design proposed is a novel “finless” type heat sink suitable for use in low profile applications. Together the driving fan and heat sinks combined were constrained to have a total footprint area of 465 mm2 and a profile height of only 5 mm, making them ideal for use in portable electronics. The objective was to evaluate the performance of the proposed finless heat sink design against a conventional finned heat sink, and this was achieved by means of thermal resistance and overall heat transfer coefficient measurements. It was found that the proposed finless design proved to be the superior cooling solution when operating at low fan speeds, while at the maximum fan speed tested of 8000 rpm both provided similar performance. Particle image velocimetry measurements were used to detail the flow structures within each heat sink and highlighted methods, which could further optimize their performance. Also, these measurements along with corresponding global volume flow rate measurements were used to elucidate the enhanced heat transfer characteristics observed for the finless design. Overall, it is shown that the proposed finless type heat sink can provide superior performance compared with conventional finned designs when used in low profile applications. In addition a number of secondary benefits associated with such a design are highlighted including lower cost, lower mass, lower acoustics, and reduced fouling issues.

scholarly journals Research on Cooling Method in Surfacing Repair Process of Aero Compressor Blade

2020 ◽  
Vol 2020 ◽  
pp. 1-19
Author(s):  
Shijie Dai ◽  
Miao Gong ◽  
Liwen Wang ◽  
Tao Wang
Keyword(s):  
Heat Transfer ◽  
Forced Convection ◽  
Heat Sink ◽  
Molten Pool ◽  
Cooling Effect ◽  
Modeling And Simulations ◽  
Cooling Method ◽  
Jet Impact ◽  
Convection Cooling ◽  
Vertical Jet

For the cooling method in surfacing repairing, most of the research focuses on the method based on the fixture structure. However, due to the low thermal conductivity and ultrathin alloy blade, the heat transfer speed from the molten pool to fixture is slow. When the heat is transferred to the fixture, most of the molten pool has solidified and absorbed or segregated out some impurities. Therefore, how to cool the welding area directly is more critical. For this reason, the thermal cycle characteristics of typical points of the blade and the heat transfer process of the key area of the fixture are analyzed, the original cooling time is calculated, and two innovative cooling methods based on lateral forced convection cooling and vertical jet impact forced convection cooling are proposed. For lateral forced cooling, with “AF-field” lateral convection cooling modeling, the cooling effects of characteristic points and sections under different flow velocities are calculated. For vertical jet impact cooling, the pressure, flow rate, and convective heat flux distribution on the wall under different impact heights and nozzle diameter are calculated. The influence of different inlet flow rates on cooling performance is influenced, based on the analysis results of impact modeling, the moving heat sink model is established, and the cooling effect under different heat sink-source distances is calculated. The heat transfer rules of two methods are analyzed in detail through modeling and simulations. The results show that both methods can improve the cooling effect and the vertical jet impact cooling method has an effect that is more obvious. When the nozzle radius is 2 mm, the impact height is 4d, the inlet flow velocity is 35 m/s, and the distance is 7 mm, and the cooling time under the vertical jet impact method is shortened by 12.5%, which can achieve better cooling effect. The experiment further validates the effectiveness of the modeling and simulations.

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