Observations in Changes of Electrical Properties in Thermally Neutron-Exposed Boron-Doped Silicon Semiconductors

2015 ◽  
Vol 1 (3) ◽  
Author(s):  
Hector E. Medina ◽  
Brian Hinderliter

Boron-doped resistors and transistors were developed using various levels of boron concentration. These were exposed to a thermal neutron flux of about 2×108  s−1 cm−2 at various fluences, at Los Alamos National Laboratory. Characterization of some electrical properties was carried out before and after irradiation. The reaction, 10B+n→Li+α, and others, caused by neutron irradiation, introduced impurities in the silicon lattice, thus producing measurable differences in electronic parameters. The results show that for irradiated resistors possessing very low values of boron concentration (≈1014  cm−3), there is a significant reduction (i.e., orders of magnitude) in resistivity, for the higher fluences studied (2×1011–1012  cm−2). This trend is not seen for high values of boron concentration (≈1021  cm−3), nor for the low-boron-concentration specimens exposed to a lower fluence. These observations appear to be in accordance with the deep-trap level behavior, and, though requiring further study, they seem to be promising for the potential application on neutron radiation detection. Additionally, there was no observation of significant changes in other electronic parameters, such as threshold voltage or trans-conductance, for the transistors exposed and tested.

Author(s):  
Hector E. Medina ◽  
Brian Hinderliter

Neutron detectors are deployed at ports of entry across the world to monitor people and cargos for smuggled nuclear materials and are often incorporated in nuclear power plant designed to monitor power levels and ensure safe operations. With the supply of Helium-3 rapidly decreasing and due to increase of terrorism threats it is vital to U.S. national security that a viable alternative material be identified, and a new neutron detector design made available, especially for portal monitoring applications. The interest to study Boron-10 as an alternative to helium-3, due to the vast natural supply that the United States possesses and its nontoxic characteristics, is increasing in different research arenas. Our work consists on taking advantage of the near 20% of boron-10 present in naturally occurring boron which (just as phosphorus) is used to dope semiconductors. Boron doped semiconductor wafers were characterized using four-point probe techniques. Resistors and transistors made with various levels of boron concentration were exposed to a thermal flux at various fluencies at Los Alamos National Laboratory. The reaction, 10B+n → Li + α, caused by neutron irradiation, introduces impurities in the silicon lattice thus producing measurable differences in electronic parameters. These changes are likely to be proportional to the fluence of the source, and hence to the neutron flux. The results show that for irradiated resistors possessing very high values of boron concentration there is a significant reduction in resistivity. This trend is not seen for medium or low values of boron. Additionally, there was no observation of significant changes in other electronic parameters such as threshold voltage or trans-conductance, for the transistors exposed and tested.


2005 ◽  
Vol 14 (3-7) ◽  
pp. 350-354 ◽  
Author(s):  
C. Baron ◽  
M. Wade ◽  
A. Deneuville ◽  
E. Bustarret ◽  
T. Kocinievski ◽  
...  

Author(s):  
Nurul Huda Osman ◽  
Nurul Najiha Mazu ◽  
Josephine Liew Ying Chyi ◽  
Muhammad Mahyiddin Ramli ◽  
Mohammad Abdull Halim Mohd Abdull Majid ◽  
...  

This paper reports on chitosan/bentonite crosslinked (ChB-ECH) film for removal of Cu (II). The effects of chitosan/bentonite ratio on the removal percentage were studied along with the effect of different Cu (II) concentration and the contact time on the film adsorption capacity, qt. The electrical properties of the film are studied, before and after the adsorption occurred, by using impedance spectroscopy for different parameters such as DC conductivity, the complex dielectric constants (ε’ and ε”) and complex electrical modulas (M’ and M’’). The results showed that the chitosan/bentonite ratio of 3:1 produces highest removal percentage at 29 %, while the contact time of 120 minutes was found to be optimum. An increment in the DC conductivity of the ChB-ECH film’s was observed up to 10-7 S/cm as the removal percentage of film increased. The film with the highest Cu (II) adsorb also showed the highest value for ε’ and ε” while exhibiting non-Derby behavior. Shifting of peak amplitude of the M” towards the higher frequency was also observed as the Cu (II) adsorption in the film increased. The results showed that all the electrical parameters can be utilized to determine the amount of adsorbed copper (II) in chitosan/bentonite film.


2018 ◽  
Vol 10 (45) ◽  
pp. 39400-39410 ◽  
Author(s):  
Konrad Thürmer ◽  
Christian Schneider ◽  
Vitalie Stavila ◽  
Raymond W. Friddle ◽  
François Léonard ◽  
...  

1990 ◽  
Vol 11 (2) ◽  
pp. 100-102 ◽  
Author(s):  
S.A. Grot ◽  
G.S. Gildenblat ◽  
C.W. Hatfield ◽  
C.R. Wronski ◽  
A.R. Badzian ◽  
...  

2001 ◽  
Vol 89 (9) ◽  
pp. 5133-5137 ◽  
Author(s):  
Hsiang-Jen Huang ◽  
Kun-Ming Chen ◽  
Chun-Yen Chang ◽  
Tien-Sheng Chao ◽  
Tiao Yuan Huang

1994 ◽  
Vol 361 ◽  
Author(s):  
W. Pan ◽  
C.L. Thio ◽  
S.B. Desu ◽  
Cheewon Chung

ABSTRACTReactive ion etching damage to sputtered Pt/PZT/Pt ferroelectric capacitors was studied using Ar and CHCIFCF3 etch gases. Electrical properties, hysteresis, fatigue, and leakage current of PZT capacitors, before and after etching, were compared to examine the etching damage. It is found that the damage effects depend on etching time and are mainly due to the physical bombardment effect. The PZT capacitors etched with CHCIFCF3 plasma showed less damage than those etched in Ar plasma. The electric properties of etched Pt/PZT/Pt capacitors are recovered by annealing at 400 °C for 30min.


1975 ◽  
Vol 11 (12) ◽  
pp. 5023-5030 ◽  
Author(s):  
D. J. DiMaria ◽  
F. J. Feigl ◽  
S. R. Butler
Keyword(s):  

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