Thermal Cycle Stability of Sealing Glass for 8YSZ Coated Cr-Containing Metal Interconnect

Author(s):  
Lian Peng ◽  
Yang Bai ◽  
Qingshan Zhu

An 8 mol. % yttria stabilized zirconia (8YSZ) coating has been prepared on a Cr-containing stainless steel interconnect (SS410) to improve the chemical compatibility of a BaO–B2O3–SiO2 sealing glass with the SS410. Three different methods as, grinding the 8YSZ coating prior to the sealing (fixture A), putting an interlayer glass on the 8YSZ coating prior to the sealing (fixture B), and exerting an external compressive force of ∼10.28 kPa during the sealing (fixture C), have been used to improve the thermal cycle stability of the sealing glass. The fixture A (using the grinding method) and the fixture B (using the interlayer method) both show poor thermal cycle stability. For the fixture C, the external compressive force is found to help the self-healing of the sealing glass. Due to the good chemical compatibility of the sealing glass with the 8YSZ coating, the sealing glass of the fixture C exhibits super long-term thermal cycle stability. The leak rates of the sealing glass of the fixture C show nearly no increase up to 280 thermal cycles, after which the leak rates increase slowly with the thermal cycles and the leak rate is still less than the Solid Energy Convergence Alliance (SECA) limit at the 626th thermal cycle.

2011 ◽  
Vol 196 (5) ◽  
pp. 2709-2716 ◽  
Author(s):  
Yeong-Shyung Chou ◽  
E.C. Thomsen ◽  
R.T. Williams ◽  
J.-P. Choi ◽  
N.L. Canfield ◽  
...  

2009 ◽  
Vol 194 (2) ◽  
pp. 880-885 ◽  
Author(s):  
Lian Peng ◽  
QingShan Zhu

Metals ◽  
2019 ◽  
Vol 9 (5) ◽  
pp. 518 ◽  
Author(s):  
Congcong Cao ◽  
Keke Zhang ◽  
Baojin Shi ◽  
Huigai Wang ◽  
Di Zhao ◽  
...  

The interface microstructure and shear strength of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints under thermal-cycle loading were investigated with scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), X-ray diffraction (XRD) and physical and chemical tests. The results show that an intermetallic compound (IMC) layer of Sn2.5Ag0.7Cu0.1RExNi/Cu solder joints evolved gradually from the scalloped into larger wavy forms with increasing number of thermal cycles. The roughness and average thickness of IMC increased with thermal-cycle loading. However, at longer thermal-cycle loading, the shear strength of the joints was reduced by about 40%. The fracture pathway of solder joints was initiated in the solder seam with ductile fracture mechanism and propagated to the solder seam/IMC layer with ductile-brittle mixed-type fracture mechanism, when the number of thermal cycles increased from 100 to 500 cycles. By adding 0.05 wt.% Ni, the growth of the joint interface IMC could be controlled, and the roughness and average thickness of the interfacial IMC layer reduced. As a result, the shear strength of joints is higher than those without Ni. When compared to joint without Ni, the roughness and average thickness of 0.05 wt.% Ni solder joint interface IMC layer reached the minimum after 500 thermal cycles. The shear strength of that joint was reduced to a minimum of 36.4% of the initial state, to a value of 18.2 MPa.


2016 ◽  
Vol 121 (12) ◽  
pp. 8523-8547 ◽  
Author(s):  
J. Weiss ◽  
V. Pellissier ◽  
D. Marsan ◽  
L. Arnaud ◽  
F. Renard
Keyword(s):  

2018 ◽  
Vol 43 (6) ◽  
pp. 602-612 ◽  
Author(s):  
C Yao ◽  
H Yang ◽  
J Yu ◽  
L Zhang ◽  
Y Zhu ◽  
...  

SUMMARY Objective: This study aimed to investigate the long-term effectiveness of ceramic–resin bonding with universal adhesives in non–silane-pretreated and silane-pretreated modes after 10,000 cycles of thermal aging. Methods and Materials: All Bond Universal, Adhese Universal, Clearfil Universal Bond, and Single Bond Universal were selected. Etched lithium disilicate glass ceramics were prepared, randomly assigned to groups, and pretreated with or without ceramic primer containing silane coupling agent prior to the application of universal adhesive (ie, silane-pretreated or non–silane-pretreated mode). The shear bond strength (SBS), microleakage, and field-emission scanning electron microscopy images of the ceramic–resin interfaces were examined after 24 hours of water storage or 10,000 thermal cycles. Light microscopy and confocal laser scanning microscopy (CLSM) were performed to analyze marginal sealing ability. Results: SBS and microleakage percentage were significantly affected by bonding procedure (non–silane-pretreated or silane-pretreated mode) and aging (24 hours or 10,000 thermal cycles). After the universal adhesives in the non–silane-pretreated mode were aged, SBS significantly decreased and microleakage percentage increased. By contrast, the SBS of Adhese Universal, Clearfil Universal Bond, and Single Bond Universal decreased, and the microleakage percentage of all of the adhesives increased in the silane-pretreated mode. However, after aging, the SBS of the silane-pretreated groups were higher and their microleakage percentages lower than those of the non–pretreated groups. In the non–silane-pretreated mode, adhesive failure was dominant and gaps between composite resin and the adhesive layer were significant when observed with CLSM. Conclusions: The simplified procedure reduced the ceramic–resin bonding effectiveness of universal adhesives after aging, and additional silane pretreatment helped improve the long-term durability.


2019 ◽  
Vol 833 ◽  
pp. 573-579 ◽  
Author(s):  
Ling Li ◽  
Jing Zhang ◽  
Youlan Zou ◽  
Wenjuan Jiang ◽  
Weixin Lei ◽  
...  

Langmuir ◽  
2017 ◽  
Vol 33 (38) ◽  
pp. 9972-9978 ◽  
Author(s):  
Liming Wang ◽  
Chihiro Urata ◽  
Tomoya Sato ◽  
Matt W. England ◽  
Atsushi Hozumi
Keyword(s):  

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