Numerical Analysis of a Hybrid Heat Sink Using Phase Change Material: Application to Cooling of Electronic Components

2008 ◽  
Author(s):  
Mustapha Faraji ◽  
Hamid El Qarnia
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Performance ◽  
Heat Sink ◽  
Energy Transport ◽  
Electronic Component ◽  
Volume Control ◽  
Algebraic Equations ◽  
Control Approach ◽  
Change Material

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM n-ecosane with melting temperature Tm = 36°C) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic component (EC) without acting the fan, during the charging process (melting of the PCM). A (2D) mathematical model was developed in order to analyze and optimize a heat sink. The governing equations for masse, momentum and energy transport were developed and discretised by using the volume control approach. The resulting algebraic equations were next solved iteratively by using TDMA algorithm. Numerical investigations were conducted in order to optimize the thermal performance of the heat sink. The optimization involves determination of the key parameters of the heat sink that maximize the time required by the base of the electronic component to reach a critical temperature.

Thermal performance of a phase change material-based heat sink in presence of nanoparticles and metal-foam to enhance cooling performance of electronics

2022 ◽  
Vol 48 ◽  
pp. 103882
Author(s):  
Adeel Arshad ◽  
Mark Jabbal ◽  
Hamza Faraji ◽  
Pouyan Talebizadehsardari ◽  
Muhammad Anser Bashir ◽  
...  
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Performance ◽  
Heat Sink ◽  
Metal Foam ◽  
Cooling Performance ◽  
Change Material

scholarly journals Thermal Performance Evaluation of a Phase Change Material Based Heat Sink: A Numerical Study

2016 ◽  
Vol 25 ◽  
pp. 1182-1190 ◽  
Author(s):  
Jesto Thomas ◽  
P.V.S.S. Srivatsa ◽  
S. Ramesh Krishnan ◽  
Rajesh Baby
Keyword(s):  
Performance Evaluation ◽  
Phase Change ◽  
Phase Change Material ◽  
Thermal Performance ◽  
Heat Sink ◽  
Numerical Study ◽  
Change Material

scholarly journals Thermal Performance of Phase Change Material Based Heat Sink for Solar Photovoltaic Cooling

2019 ◽  
Vol 8 (9) ◽  
pp. 3320-3323 ◽  
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Performance ◽  
Heat Sink ◽  
Paraffin Wax ◽  
Transient Temperature ◽  
Solar Photovoltaic ◽  
Solar Pv ◽  
Pv Panel ◽  
Change Material

Solar photovoltaic panels can receive only eighty percent of total incident solar radiation. A small amount of incident energy is transformed into electrical energy based on the efficiency of the photovoltaic (PV) cell. The remaining energy leads to an increase in photovoltaic cell operating temperature which affects its life and power output. Cooling of PV panel is the best way to improve the efficiency either by passive or active cooling methods. PV cooling by Phase change materials (PCM) is the best effective technique. Paraffin wax is a non toxic material having high latent heat of fusion used for many thermal applications. In this study, paraffin wax is taken as phase change material in aluminum heat sink with fins. Using DSC, the melting point of paraffin wax is analysed. The flat plate heater is used instead of solar PV panel. Different wattages are used for the experiments. Different inclinations such as horizontal (00 ), vertical (900 ) and intermediate (450 ) were taken in to consideration. The melting starts at 50oC and complete melting occurs at a temperature around 60oC for the paraffin based heat sink. The heat sink surface temperatures, fin temperatures and PCM temperatures are measured. The transient temperature distribution of heat sink, PCM is analysed at different wattage inputs. The total thermal performance of this paraffin PCM based heat sink was analysed experimentally. This infers that the cooling of high temperature of PV panels can be done by using paraffin based PCM to increase the efficiency and life of the panels.

scholarly journals Thermal performance of a 3D printed lattice-structure heat sink packaging phase change material

2020 ◽  
Author(s):  
Yuandong GUO ◽  
Huning YANG ◽  
Guiping LIN ◽  
Haichuan JIN ◽  
Xiaobin SHEN ◽  
...  
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Performance ◽  
Heat Sink ◽  
Lattice Structure ◽  
3D Printed ◽  
Change Material

Passive Cooling of Protruding Electronic Components by Latent Heat of Fusion Storage

2009 ◽  
Vol 131 (2) ◽  
Author(s):  
Mustapha Faraji ◽  
Hamid El Qarnia
Keyword(s):  
Heat Sink ◽  
Cooling System ◽  
Heat Removal ◽  
Electronic Component ◽  
Heat Of Fusion ◽  
Volume Control ◽  
Maximum Temperature ◽  
Algebraic Equations ◽  
Electronic Components ◽  
Control Approach

The aim of the present work is to study the thermal performance of a hybrid heat sink used for cooling management of protruding substrate-mounted electronic chips. The power generated in electronic chips is dissipated in phase change material (PCM) (n-eicosane with melting temperature Tm=36°C) that filled a rectangular enclosure. The advantage of using this cooling strategy is that the PCMs are able to absorb a high amount of heat generated by electronic component (EC) without acting the fan, during the charging process (melting of the PCM). A two-dimensional mathematical model was developed in order to analyze and optimize a heat sink. The governing equations for masse, momentum, and energy transport were developed and discretized by using the volume control approach. The resulting algebraic equations were next solved iteratively by using tri diagonal matrix algorithm. A series of numerical investigations were conducted in order to examine the effects of the heat generation based Rayleigh number, Ra, and the position of the bottom electronic component, Lh, on the thermal behavior of the proposed cooling system. Results are obtained for velocity and temperature distributions, maximum temperature heat sources, percentage contribution of plate (substrate) heat conduction on the heat removal from electronic components, temperature profile within finite conductive plate and local heat flux density at the plate—modules/PCM interface. The effect of these two key parameters on the electronic component working time (time required by electronic components to reach a critical temperature, Tcr) was analyzed.

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