Piezoelectric Thin Film AlN Annular Dual Contour Mode Bandpass Filter

Author(s):  
Philip J. Stephanou ◽  
Gianluca Piazza ◽  
Carolyn D. White ◽  
Muthu B. J. Wijesundara ◽  
Albert P. Pisano

The following work presents the analytical, numerical and experimental characterization of a novel piezoelectric Aluminum Nitride MEMS bandpass filter. In contrast to multipole filters employing distinct mechanically or electrically coupled resonator building blocks, the passband of the device in the present work is defined by the proximity of two natural contour modes of vibration in a single annular resonator. The proposed implementation, albeit currently limited to dual-pole filters, results in smaller form factors and reduces device sensitivity to across wafer fabrication tolerances.

2014 ◽  
Vol 11 (99) ◽  
pp. 20140099 ◽  
Author(s):  
Javier Cervera ◽  
José A. Manzanares ◽  
Salvador Mafe

The interplay between cooperativity and diversity is crucial for biological ensembles because single molecule experiments show a significant degree of heterogeneity and also for artificial nanostructures because of the high individual variability characteristic of nanoscale units. We study the cross-effects between cooperativity and diversity in model threshold ensembles composed of individually different units that show a cooperative behaviour. The units are modelled as statistical distributions of parameters (the individual threshold potentials here) characterized by central and width distribution values. The simulations show that the interplay between cooperativity and diversity results in ensemble-averaged responses of interest for the understanding of electrical transduction in cell membranes, the experimental characterization of heterogeneous groups of biomolecules and the development of biologically inspired engineering designs with individually different building blocks.


2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.


1982 ◽  
Vol 10 (1) ◽  
pp. 37-54 ◽  
Author(s):  
M. Kumar ◽  
C. W. Bert

Abstract Unidirectional cord-rubber specimens in the form of tensile coupons and sandwich beams were used. Using specimens with the cords oriented at 0°, 45°, and 90° to the loading direction and appropriate data reduction, we were able to obtain complete characterization for the in-plane stress-strain response of single-ply, unidirectional cord-rubber composites. All strains were measured by means of liquid mercury strain gages, for which the nonlinear strain response characteristic was obtained by calibration. Stress-strain data were obtained for the cases of both cord tension and cord compression. Materials investigated were aramid-rubber, polyester-rubber, and steel-rubber.


AIAA Journal ◽  
2002 ◽  
Vol 40 ◽  
pp. 16-25
Author(s):  
J. P. Wojno ◽  
T. J. Mueller ◽  
W. K. Blake

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