Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model
Keyword(s):
In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.
Keyword(s):
2017 ◽
pp. 1415-1422
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Simulation of adhesive joints using the superimposed finite element method and a cohesive zone model
2011 ◽
Vol 31
(5)
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pp. 357-362
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