Simulation of Dynamic Fracture Along Solder-Pad Interfaces Using a Cohesive Zone Model

Author(s):  
Jianping Jing ◽  
Feng Gao ◽  
Janine Johnson ◽  
Frank Z. Liang ◽  
Richard L. Williams ◽  
...  

In this paper, dynamic fracture of a single solder joint specimen is numerically simulated using the finite element method. The solder-IMC and IMC-Cu pad interfaces are modeled as cohesive zones. The simulated results show that under pure tensile loading, damage typically starts at the edge of the solder-IMC interface, then moves to IMC-Cu pad interface. Eventual failure is typically a brittle interfacial failure of the IMC-Cu interface.

2001 ◽  
Vol 54 (1) ◽  
pp. 49-67 ◽  
Author(s):  
Leon L. Mishnaevsky ◽  
Siegfried Schmauder

Advanced finite element techniques for the simulation of materials behavior under mechanical loading are reviewed. Advantages, limitations and perspectives of different approaches are analyzed for the simulation of deformation, damage and fracture of materials taking into account their micro- and mesostructure. Development of simulation methods for different aspects of materials behavior (such as the unit cell approach, real structure simulation, cohesive zone model, etc) is described including the simple versions of the methods as well as the advanced, highly efficient models. Possibilities of using the finite element method in the development of new materials are analyzed. This review article contains 131 references.


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