The Steady-State Modeling and Analysis of a Two-Loop Cooling System for High Heat Flux Removal

2009 ◽  
Author(s):  
Rongliang Zhou ◽  
Juan Catano ◽  
Tiejun Zhang ◽  
John T. Wen ◽  
Greg J. Michna ◽  
...  
Keyword(s):  
Heat Flux ◽  
Steady State ◽  
Heat Exchangers ◽  
Cooling System ◽  
High Heat ◽  
System Structure ◽  
High Heat Flux ◽  
Vapor Compression ◽  
Vapor Compression Cycle ◽  
Compression Cycle

Steady-state modeling and analysis of a two-loop cooling system for high heat flux removal applications are studied. The system structure proposed consists of a primary pumped loop and a vapor compression cycle (VCC) as the secondary loop to which the pumped loop rejects heat. The pumped loop consists of evaporator, condenser, pump, and bladder liquid accumulator. The pumped loop evaporator has direct contact with the heat generating device and CHF must be higher than the imposed heat fluxes to prevent device burnout. The bladder liquid accumulator adjusts the pumped loop pressure level and, hence, the subcooling of the refrigerant to avoid pump cavitation and to achieve high critical heat flux (CHF) in the pumped loop evaporator. The vapor compression cycle of the two-loop cooling system consists of evaporator, liquid accumulator, compressor, condenser and electronic expansion valve. It is coupled with the pumped loop through a fluid-to-fluid heat exchanger that serves as both the vapor compression cycle evaporator and the pumped loop condenser. The liquid accumulator of the vapor compression cycle regulates the cycle active refrigerant charge and provides saturated vapor to the compressor at steady state. The heat exchangers are modeled with the mass, momentum, and energy balance equations. Due to the projected incorporation of microchannels in the pumped loop to enhance the heat transfer in heat sinks, the momentum equation, rarely seen in previous refrigeration system modeling efforts, is included to capture the expected significant microchannel pressure drop witnessed in previous experimental investigations. Electronic expansion valve, compressor, pump, and liquid accumulators are modeled as static components due to their much faster dynamics compared with heat exchangers. The steady-state model can be used for static system design that includes determining the total refrigerant charge in the vapor compression cycle and the pumped loop to accommodate the varying heat load, sizing of various components, and parametric studies to optimize the operating conditions for a given heat load. The effect of pumped loop pressure level, heat exchangers geometries, pumped loop refrigerant selection, and placement of the pump (upstream or downstream of the evaporator) are studied. The two-loop cooling system structure shows both improved coefficient of performance (COP) and CHF overthe single loop vapor compression cycle investigated earlier by authors for high heat flux removal.

Model Predictive Control of a Pumped Two-Phase Cooling System With Microchannel Heat Exchangers

2018 ◽  
Author(s):  
Oyuna Angatkina ◽  
Andrew Alleyne
Keyword(s):  
Heat Flux ◽  
Model Predictive Control ◽  
Predictive Control ◽  
Heat Exchangers ◽  
Cooling System ◽  
High Heat ◽  
High Heat Flux ◽  
Two Phase ◽  
Cooling Systems ◽  
Two Phase Cooling

Two-phase cooling systems provide a viable technology for high–heat flux rejection in electronic systems. They provide high cooling capacity and uniform surface temperature. However, a major restriction of their application is the critical heat flux condition (CHF). This work presents model predictive control (MPC) design for CHF avoidance in two-phase pump driven cooling systems. The system under study includes multiple microchannel heat exchangers in series. The MPC controller performance is compared to the performance of a baseline PI controller. Simulation results show that while both controllers are able to maintain the two-phase cooling system below CHF, MPC has significant reduction in power consumption compared to the baseline controller.

Multivariable Control of Vapor Compression Cycle With Transient Heat Flux

2013 ◽  
Author(s):  
Zehao Yang ◽  
Daniel T. Pollock ◽  
John T. Wen
Keyword(s):  
Heat Flux ◽  
Open Loop ◽  
Controller Synthesis ◽  
Operating Point ◽  
High Heat Flux ◽  
Vapor Compression ◽  
Worst Case ◽  
Vapor Compression Cycle ◽  
Compression Cycle ◽  
Model Linearization

This paper investigates feedback control of refrigeration cycles for high heat-flux cooling applications, where large transient heat loads may be present. We apply H∞ controller synthesis for disturbance rejection, with the evaporator heat-flux treated as the disturbance input. The controller synthesis is based on model linearization about a chosen operating point. We analyze model uncertainty due to the linearization error to ensure robustness of the closed-loop systems. We use a low-order, lumped-element nonlinear model for the vapor compression cycle. We obtain linearized systems at different operating points, and quantify system nonlinearity using the H∞ norm. Controllers synthesized for the chosen nominal systems are tested for both nominal (near the operating point) and the worst-case performance in nonlinear simulations. For systems close to critical heat-flux (CHF), it is shown that a trade-off exists between the nominal performance and robust stability. For systems far away from CHF, it is shown that the open-loop system has the optimal cooling capacity. The performance of H∞ controller for systems near CHF is validated by experiment.

Development of Cooling System for a Large Area at High Heat Flux by Using Flow Boiling in Narrow Channels

2009 ◽  
Author(s):  
Shinichi Miura ◽  
Yukihiro Inada ◽  
Yasuhisa Shinmoto ◽  
Haruhiko Ohta
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Flow Rate ◽  
Mass Velocity ◽  
Cooling System ◽  
Volumetric Flow Rate ◽  
High Heat ◽  
High Heat Flux ◽  
Gap Size ◽  
Heated Channel

Advance of an electronic technology has caused the increase of heat generation density for semiconductors densely integrated. Thermal management becomes more important, and a cooling system for high heat flux is required. It is extremely effective to such a demand using flow boiling heat transfer because of its high heat removal ability. To develop the cooling system for a large area at high heat flux, the cold plate structure of narrow channels with auxiliary unheated channel for additional liquid supply was devised and confirmed its validity by experiments. A large surface of 150mm in heated length and 30mm in width with grooves of an apex angle of 90 deg, 0.5mm depth and 1mm in pitch was employed. A structure of narrow rectangular heated channel between parallel plates with an unheated auxiliary channel was employed and the heat transfer characteristics were examined by using water for different combinations of gap sizes and volumetric flow rates. Five different liquid distribution modes were tested and their data were compared. The values of CHF larger than 1.9×106W/m2 for gap size of 2mm under mass velocity based on total volumetric flow rate and on the cross section area of main heated channel 720kg/m2s or 1.7×106W/m2 for gap size of 5mm under 290kg/m2s were obtained under total volumetric flow rate 4.5×10−5m3/s regardless of the liquid distribution modes. Under several conditions, the extensions of dry-patches were observed at the upstream location of the main heated channel resulting burnout not at the downstream but at the upstream. High values of CHF larger than 2×106W/m2 were obtained only for gap size of 2mm. The result indicates that higher mass velocity in the main heated channel is more effective for the increase in CHF. It was clarified that there is optimum flow rate distribution to obtain the highest values of CHF. For gap size of 2mm, high heat transfer coefficient as much as 7.4×104W/m2K were obtained at heat flux 1.5×106W/m2 under mass velocity 720kg/m2s based on total volumetric flow rate and on the cross section area of main heated channel. Also to obtain high heat transfer coefficient, it is more useful to supply the cooling liquid from the auxiliary unheated channel for additional liquid supply in the transverse direction perpendicular to the flow in the main heated channel.

Rechargeable Personal Air Conditioning Device

2016 ◽  
Author(s):  
Yilin Du ◽  
Jan Muehlbauer ◽  
Jiazhen Ling ◽  
Vikrant Aute ◽  
Yunho Hwang ◽  
...  
Keyword(s):  
Air Conditioning ◽  
Cooling System ◽  
Cooling Capacity ◽  
Comfort Level ◽  
Vapor Compression ◽  
Air Conditioning System ◽  
System A ◽  
Single Person ◽  
Vapor Compression Cycle ◽  
Compression Cycle

A rechargeable personal air-conditioning (RPAC) device was developed to provide an improved thermal comfort level for individuals in inadequately cooled environments. This device is a battery powered air-conditioning system with the phase change material (PCM) for heat storage. The condenser heat is stored in the PCM during the cooling operation and is discharged while the battery is charged by using the vapor compression cycle as a thermosiphon loop. The conditioned air is discharged towards a single person through adjustable nozzle. The main focus of the current research was on the development of the cooling system. A 100 W cooling capacity prototype was designed, built, and tested. The cooling capacity of the vapor compression cycle measured was 165.6 W. The PCM was recharged in nearly 8 hours under thermosiphon mode. When this device is used in the controlled built environment, the thermostat setting can be increased so that building air conditioning energy can be saved by about 5–10%.

scholarly journals High-heat flux tests of tungsten divertor mock-ups with steady-state plasma and e-beam

2020 ◽  
Vol 25 ◽  
pp. 100816
Author(s):  
V.P. Budaev ◽  
S.D. Fedorovich ◽  
A.V. Dedov ◽  
A.V. Karpov ◽  
A.T. Komov ◽  
...  
Keyword(s):  
Heat Flux ◽  
Steady State ◽  
High Heat ◽  
High Heat Flux ◽  
State Plasma

Optimization of Refrigeration Systems for High-Heat-Flux Microelectronics

2008 ◽  
Author(s):  
P. E. Phelan ◽  
Y. Gupta ◽  
H. Tyagi ◽  
R. Prasher ◽  
J. Cattano ◽  
...  
Keyword(s):  
Heat Flux ◽  
Energy Consumption ◽  
System Design ◽  
High Heat ◽  
Heat Fluxes ◽  
Operating Conditions ◽  
High Heat Flux ◽  
Vapor Compression ◽  
Refrigeration System ◽  
Compressor Inlet

Increasingly, military and civilian applications of electronics require extremely high heat fluxes, on the order of 1000 W/cm2. Thermal management solutions for these severe operating conditions are subject to a number of constraints, including energy consumption, controllability, and the volume or size of the package. Calculations indicate that the only possible approach to meeting this heat flux condition, while maintaining the chip temperature below 50 °C, is to utilize refrigeration. Here we report an initial optimization of the refrigeration system design. Because the outlet quality of the fluid leaving the evaporator must be held to approximately less than 20%, in order to avoid reaching critical heat flux, the refrigeration system design is dramatically different from typical configurations for household applications. In short, a simple vapor-compression cycle will require excessive energy consumption, largely because of the superheat required to return the refrigerant to its vapor state before the compressor inlet. A better design is determined to be a “two-loop” cycle, in which the vapor-compression loop is coupled thermally to a primary loop that directly cools the high-heat-flux chip.

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