Parametric Finite Element Analysis of Physical Stimuli Resulting From Mechanical Stimulation of Tissue Engineered Cartilage

2008 ◽  
Author(s):  
Omotunde M. Babalola ◽  
Lawrence J. Bonassar
Keyword(s):  
Finite Element Analysis ◽  
Cell Types ◽  
Cartilage Tissue ◽  
Low Density ◽  
Cell Type ◽  
Element Analysis ◽  
Physical Stimuli ◽  
Parametric Finite Element Analysis ◽  
Engineered Cartilage ◽  
Stimulation Of

The avascular nature of cartilage results in its limited inability to repair itself upon injury. As a result numerous approaches are being investigated as potential therapies for repair, including tissue engineering strategies. In addition, due to the low density of chondrocytes and the characteristic de-differentiation of the cells when expanded in monolayer [1], other cell types are being investigated as a source for cartilage repair as well. Mesenchymal stem cells (MSCs), which have been shown to differentiate into cells of several lineages including chondrocytes, osteoblasts and adipocytes [2], are being explored as a potential cell type for the regeneration of articular cartilage tissue [3,4].

Reusability-based selection of parametric finite element analysis models

2009 ◽  
Vol 23 (2) ◽  
pp. 197-214
Author(s):  
Nsikan Udoyen ◽  
David W. Rosen
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Adaptive Reuse ◽  
Element Analysis ◽  
Fea Modeling ◽  
New Information ◽  
Parametric Finite Element Analysis ◽  
Method Factors ◽  
Analysis Models ◽  
Selection Of

AbstractA selection method to support adaptive reuse of parametric finite element analysis (FEA) models is introduced in this paper. Adaptive reuse of engineering artifacts such as FEA models is common in product design, but difficult to automate because of the need to integrate new information. The proposed method factors reusability into selection by evaluating models based on comparative estimates of effort involved in adapting them for reuse to model a query problem. The method is developed for FEA models of component-based designs. FEA modeling of electronic chip packages is used to illustrate the method's usefulness. We conclude with a discussion on the method's advantages and limitations and highlight important issues for further research.

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