Reducing thermal mismatch stress in anodically bonded silicon–glass wafers: theoretical estimation

2017 ◽  
Vol 16 (1) ◽  
pp. 015003 ◽  
Author(s):  
Leonid S. Sinev ◽  
Vladimir T. Ryabov
2019 ◽  
Vol 248 ◽  
pp. 55-59 ◽  
Author(s):  
Sha Liu ◽  
Zhijie Wang ◽  
Jing Guo ◽  
Zhijun Shi ◽  
Xuejun Ren ◽  
...  

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Y. N. Hou ◽  
K. M. Yang ◽  
J. Song ◽  
H. Wang ◽  
Y. Liu ◽  
...  

AbstractOriginated at heterogeneous interfaces with distinct coefficient of thermal expansion (CTE), thermal mismatch stress is one of the critical influential factors to mechanical properties of metal matrix composites (MMCs). This stress is normally accommodated plastically by various defects, for example, high-density dislocations and twins in Al near heterogeneous interfaces in SiC/Al composites. Basic knowledge on the influence of defect characteristics is important but difficult to extrapolate from experimental results. However, existed theoretical models more focus on the influence of dislocation density, but less focus on defects variety, volume and distribution. In this paper, we propose a physics-based crystal plasticity model that has the capability of dealing with thermal mismatch stress induced dislocations and twins (denoted as TMDT model). The proposed TMDT model that is implemented in the Visco-Plastic Self-Consistent (VPSC) method considers defect heterogeneous distribution (gradient range), defect type (dislocations vs. twins) and defect volume fraction (twin spacing vs. twin volume). We demonstrate the validity and the capability of the VPSC-TMDT model in SiC/Al composites with thermal mismatch induced dislocations or twins. Furthermore, this model predicts the ultra-high strength of Graphene/Copper composites with high-density nanoscale twins, which is in turn the future aim for such nanocomposites.


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