Ultrafast reflection and secondary ablation in laser processing of transparent dielectrics with ultrashort pulses

2014 ◽  
Vol 53 (5) ◽  
pp. 051512 ◽  
Author(s):  
Mingying Sun ◽  
Urs Eppelt ◽  
Wolfgang Schulz ◽  
Jianqiang Zhu
2005 ◽  
Author(s):  
Ronan Le Harzic ◽  
Detlef Breitling ◽  
S. Sommer ◽  
Christian Fohl ◽  
S. Valette ◽  
...  

2020 ◽  
Vol 21 (2) ◽  
pp. 279-283
Author(s):  
S. M. Levytskyi

This paper deals with the main characteristics of the influence of pulsed laser radiation and its application for the labeling of transparent dielectrics. On the basis of the analysis of the literature data and the study of the possibilities of using laser radiation for marking different materials, it is proposed to investigate the effect of the radiation wavelength on the size of the received defect inside the material. Experimentally shown that the pulse laser processing of samples with laser irradiation energy below 3.4 mJ/cm2 visual tags in the sample are not formed. Thus, you can control the geometric dimensions of the mark.


2000 ◽  
Author(s):  
J. Sun ◽  
J. P. Longtin ◽  
P. M. Norris

Abstract Silica aerogels are unique nanostructured materials that possess many distinctive qualities, including extremely low densities and thermal conductivities, very high surface-area-to-volume ratios, and large strength-to-weight ratios. Aerogels, however, are very brittle, and are not readily shaped using traditional machining operations. Ultrafast laser processing may provide an alternative for precision shaping and machining of these materials. This paper discusses investigations of ultrafast laser machining of aerogels for material removal and micromachining. The advantages of ultrafast laser processing include a minimal thermal penetration region and low processing temperatures, precision removal of material, and good-quality feature definition. In this work, an amplified femtosecond Ti:sapphire laser system is used to investigate the breakdown threshold, material removal rate, and specific issues associated with laser processing of aerogels, as well as recommendations for further investigations for these unique materials.


2020 ◽  
Vol 32 (2) ◽  
pp. 022041
Author(s):  
Boyang Zhou ◽  
Arifur Rahaman ◽  
Xinpeng Du ◽  
Aravinda Kar ◽  
M. J. Soileau ◽  
...  

Micromachines ◽  
2021 ◽  
Vol 12 (5) ◽  
pp. 499
Author(s):  
Agnė Butkutė ◽  
Linas Jonušauskas

The rapid expansion of femtosecond (fs) laser technology brought previously unavailable capabilities to laser material processing. One of the areas which benefited the most due to these advances was the 3D processing of transparent dielectrics, namely glasses and crystals. This review is dedicated to overviewing the significant advances in the field. First, the underlying physical mechanism of material interaction with ultrashort pulses is discussed, highlighting how it can be exploited for volumetric, high-precision 3D processing. Next, three distinct transparent material modification types are introduced, fundamental differences between them are explained, possible applications are highlighted. It is shown that, due to the flexibility of fs pulse fabrication, an array of structures can be produced, starting with nanophotonic elements like integrated waveguides and photonic crystals, ending with a cm-scale microfluidic system with micro-precision integrated elements. Possible limitations to each processing regime as well as how these could be overcome are discussed. Further directions for the field development are highlighted, taking into account how it could synergize with other fs-laser-based manufacturing techniques.


2003 ◽  
Author(s):  
Czeslaw Radzewicz ◽  
W. Wasilewski ◽  
P. Wasylczyk ◽  
Marek Trippenbach ◽  
Jerzy S. Krasinski

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