scholarly journals Chip scale package fiber optic transceiver integration for harsh environments

Author(s):  
Charles Kuznia ◽  
Chuck Tabbert
2022 ◽  
Author(s):  
Zhiqiang Shao ◽  
Yalin Wu ◽  
Shuang Wang ◽  
Yan Wang ◽  
Zhiqiang Sun ◽  
...  

2015 ◽  
Vol 2015 (1) ◽  
pp. 000609-000615 ◽  
Author(s):  
John Mazurowski

Present fiber optic connections need to align two or more optical fibers to accuracies of microns (multimode fiber) and tenths of a micron (single more fiber). For connections in rugged applications, consisting of wide temperature ranges, substantial vibration, or in the presence of contaminants, the alignment of normal physical contact connections becomes even more difficult. New expanded beam connectors make fiber optic connections more durable, and help stabilize the transmission of high speed optical signals between systems, boxes, boards, and devices in these harsh environments.


2011 ◽  
Author(s):  
William K. Bischel ◽  
Mikhail A. Kouchnir ◽  
Martin Bitter ◽  
Ram Yahalom ◽  
Edward W. Taylor

2002 ◽  
Author(s):  
Hanying Liu ◽  
Don W. Miller ◽  
Joseph Talnagi

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