Quantum Key Distribution Transmitter Chip Based on Hybrid-integration of Silica and Lithium Niobates

A quantum key distribution transmitter chip based on hybrid‐integration of silica planar light‐wave circuit (PLC) and lithium niobates (LN) modulator PLC is presented. The silica part consists of a tunable directional coupler and 400 ps delay line, and the LN part is made up of a Y‐branch, with electro‐optic modulators on both arms. The two parts are facet‐coupled to form an asymmetric Mach‐Zehnder interferometer. We have successfully encoded and decoded four BB84 states at 156.25 MHz repetition rate. Fast phase‐encoding of 0 or π has been achieved, with interference fringe visibilities 78.53% and 82.68% for state |+> and |‐>, respectively. With the aid of an extra off‐chip LN intensity modulator, two time‐bin states have been prepared and the extinction ratios are 18.65 dB and 15.46 dB for state |0> and |1>, respectively.

Virtual Retail

<p>Retail design has always been much more than selling products; it is a way for the brands to express them self. It is what they stand for through their brand essences. Turning their manifestation into physical forms to create space this physical space that interns offers the consumer an experiences. The interior architecture, bridges the gap between brand and consumers, as it evokes the essence of the brand while envisaging in an architectural form and tells one a story. However, since the birth of the e-consumer market, this gap that’s has differentiated the two apart has gotten widen, as 2D webpage can only offer so much. The interaction provided is minimal thus removing some of the experiential and service elements that traditionally a physical store would offer. This consequence lowers the brand engagement due to the limiting physical interaction of a webpage. Virtual Reality (VR) has become largely popular within many different sectors such as education, entertainment and military. This thesis proposes to explore how virtual reality can be used as an extending to the e-consumer market and articulate a hybrid integration for a shopping environment. The thesis will use precedents of brand identity, brand identity “is the manifestation of a brand that can be seen, heard and immediately experienced” this is the embodied of the brand in the physical form. Brand identity will be used to design the virtual environment.</p>

Virtual Retail

<p>Retail design has always been much more than selling products; it is a way for the brands to express them self. It is what they stand for through their brand essences. Turning their manifestation into physical forms to create space this physical space that interns offers the consumer an experiences. The interior architecture, bridges the gap between brand and consumers, as it evokes the essence of the brand while envisaging in an architectural form and tells one a story. However, since the birth of the e-consumer market, this gap that’s has differentiated the two apart has gotten widen, as 2D webpage can only offer so much. The interaction provided is minimal thus removing some of the experiential and service elements that traditionally a physical store would offer. This consequence lowers the brand engagement due to the limiting physical interaction of a webpage. Virtual Reality (VR) has become largely popular within many different sectors such as education, entertainment and military. This thesis proposes to explore how virtual reality can be used as an extending to the e-consumer market and articulate a hybrid integration for a shopping environment. The thesis will use precedents of brand identity, brand identity “is the manifestation of a brand that can be seen, heard and immediately experienced” this is the embodied of the brand in the physical form. Brand identity will be used to design the virtual environment.</p>

A Hybrid Antenna in Package Solution Using FOWLP Technology

Widespread millimeter wave applications have promoted rapid development of System in Package (SiP) and Antenna in Package (AiP). Most AiP structures take the form of flip chip on antenna substrate, where interconnect losses are caused by solder bumps, and manufacturing difficulties may be encountered for chips with fine pad pitches. Fan-out wafer level package (FOWLP) with antenna patterning on Redistributed Layers (RDL) is another method for mm-wave AiP realization. In this project a hybrid integration AiP structure is developed. The Microwave Monolithic Integrated Circuit (MMIC) chip and antenna unit are integrated with chip-first FOWLP process. By using multilayer organic substrate and fine pitch RDL interconnection, proper antenna performance and lower transmission loss can be achieved. Modified coplanar waveguide is adopted to feed 2x2 aperture array formed on RDL. Package warpage is evaluated using ANSYS and Shadow Moire measurement. The antenna realizes bandwidth 25% and gain 8.5dBi using aperture-coupled stacked patch for 60GHz digital communication system. The proposed approach is a convenient solution for the hybrid integration of millimeter wave AiP systems.