Ultra-precision grinding and accuracy measurement of the hard-brittle thin-walled tubular optics

2021 ◽  
Author(s):  
Yin Hang ◽  
Wang Sheng ◽  
Zhao Qingliang ◽  
Guo Bing ◽  
Zhao Jianbo
2021 ◽  
Author(s):  
Yapeng Jia ◽  
Peng Wang ◽  
Hao Zhang ◽  
Hongshun Zhang ◽  
Tianyu Zhao ◽  
...  

2006 ◽  
Vol 304-305 ◽  
pp. 251-255
Author(s):  
L. Zheng ◽  
Yin Biao Guo ◽  
Z.Z. Wang

This paper puts forward an intelligent single-plane biaxial balance monitor system, which is used in ultra-precision grinding. It adopts the method of single-plane balance correction for the vibration of wheel and workpiece. And this system can also be used for integral balance. For ultra-precision grinding, caused by the mutual influence of the vibration of wheel and workpiece, there will be a ripple on the workpiece surface, which is mainly influenced by the frequency ratio of wheel to workpiece, the feed rate and the vibration of wheel and workpiece. This system can improve the machining accuracy, reduce the surface error of workpiece and appraise the integrated machining result, by analyzing the vibration data of wheel and workpiece and adjusting machining parameters.


Author(s):  
Katsutoshi Tanaka ◽  
Masahiko Fukuta ◽  
Kiyoshi Suzuki ◽  
Manabu Iwai ◽  
Tetsutaro Uematsu ◽  
...  

2010 ◽  
Vol 447-448 ◽  
pp. 183-187 ◽  
Author(s):  
Zhen Yu Zhang ◽  
Rudy Irwan ◽  
Han Huang

Surface characteristics of CZT wafers machined using wire sawing, free abrasives lapping and polishing and ultra-precision grinding were investigated. Wire sawing resulted in the removal of material in both ductile and brittle regimes, but both polishing and grinding led to a ductile removal. The grinding produced very smooth surfaces free of embeddings and scratches, which is thus considered to have better machinability than the free abrasive machining. The nanoindentation and nanoscratch on MCT wafers at nanometric scales resulted in considerable plastic deformation, but no fracture features. The hardness of the MCT wafer was 500 to 550 MPa, and the coefficient of friction was particularly high, ranging from 0.45 to 0.55.


2009 ◽  
Vol 69-70 ◽  
pp. 39-43 ◽  
Author(s):  
Li Jun Li ◽  
Fei Hu Zhang ◽  
Shen Dong

Parallel grinding is an effective method of aspheric moulds machining which is usually made of industrial ceramic such as silicon carbide (SiC) or tungsten carbide (WC), but if the spherical grinding wheel is not being with precision truing and dressing, the roughness and form accuracy of the ground aspheric surface should get worse, for this reason, in this paper, the influence factors of thoroughness and form accuracy induced by the wheel truing and dressing are studied firstly, and a new 3-axis CNC Ultra-precision grinding system which is based on the PMAC (Programmable Multi-axes Controller) is developed, through simultaneous motion of the controlled X, Z and B axis, the form errors which is induced by the grinding wheel can be improved theoretically, and the aspheric mould machining test shown that the surface roughness of Ra 0.025μm and the form accuracy of P-V 1.15μm are achieved.


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