High sensitivity capacitive MEMS microphone with spring supported diaphragm

Author(s):  
Norizan Mohamad ◽  
Pio Iovenitti ◽  
Thurai Vinay
2019 ◽  
Vol 2019 ◽  
pp. 1-26 ◽  
Author(s):  
Muhammad Ali Shah ◽  
Ibrar Ali Shah ◽  
Duck-Gyu Lee ◽  
Shin Hur

This paper reports a review about microelectromechanical system (MEMS) microphones. The focus of this review is to identify the issues in MEMS microphone designs and thoroughly discuss the state-of-the-art solutions that have been presented by the researchers to improve performance. Considerable research work has been carried out in capacitive MEMS microphones, and this field has attracted the research community because these designs have high sensitivity, flat frequency response, and low noise level. A detailed overview of the omnidirectional microphones used in the applications of an audio frequency range has been presented. Since the microphone membrane is made of a thin film, it has residual stress that degrades the microphone performance. An in-depth detailed review of research articles containing solutions to relieve these stresses has been presented. The comparative analysis of fabrication processes of single- and dual-chip omnidirectional microphones, in which the membranes are made up of single-crystal silicon, polysilicon, and silicon nitride, has been done, and articles containing the improved performance in these two fabrication processes have been explained. This review will serve as a starting guide for new researchers in the field of capacitive MEMS microphones.


2020 ◽  
Vol 67 (9) ◽  
pp. 1509-1513
Author(s):  
Youngtae Yang ◽  
Byunggyu Lee ◽  
Jun Soo Cho ◽  
Suhwan Kim ◽  
Hyunjoong Lee

2015 ◽  
Vol 15 (12) ◽  
pp. 6853-6860 ◽  
Author(s):  
Byung-Hun Kim ◽  
Hwa-Sun Lee

2013 ◽  
Vol 19 (9-10) ◽  
pp. 1425-1431 ◽  
Author(s):  
Paul C.-P. Chao ◽  
Chun-Yin Tsai ◽  
Chi-Wei Chiu ◽  
Che-Hung Tsai ◽  
Tse-Yi Tu

2021 ◽  
Vol 0 (0) ◽  
Author(s):  
Hamid Reza Ansari ◽  
Zoheir Kordrostami

Abstract In this paper, the improvement of the sensitivity of a capacitive MEMS pressure sensor is investigated. The proposed spring for the sensor can increase the sensitivity. Silicon is used as the substrate and gold and aluminium nitrate are used as the diaphragm and the dielectric layer, respectively. The dimensions of the diaphragm are 150 µm × 150 µm, which is suspended by four springs. The air gap between the diaphragm and the top electrode is 1.5 µm. The proposed structure is an efficient sensor for the pressures in the range of 1–20 kPa. By using the proposed design, the sensitivity of the MEMS sensor in 18 kPa has improved to 663 (× 10−3 pF/kPa).


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