Grain Boundary Sliding and Lattice Dislocation Emission in Nanocrystalline Materials under Plastic Deformation

2005 ◽  
Vol 47 (9) ◽  
pp. 1662 ◽  
Author(s):  
M. Yu. Gutkin
2011 ◽  
Vol 683 ◽  
pp. 69-79 ◽  
Author(s):  
Evgeny V. Naydenkin ◽  
Galina P. Grabovetskaya ◽  
Konstantin Ivanov

In this review the investigations of deformation process development are discussed which were carried out by tension and creep in the temperature range Т<0.4Tm (here Тm is the absolute melting point of material) for nanostructured metals produced by the methods of severe plastic deformation. The contribution of grain boundary sliding to the total deformation in the above temperature interval is also considered. An analysis is made of the effect of grain size and grain boundary state on the evolution of grain boundary sliding and cooperative grain boundary sliding in nanostructured metals.


2001 ◽  
Author(s):  
J. Narayan ◽  
H. Wang ◽  
A. Kvit

Abstract We have synthesized nanocrystalline thin films of Cu, Zn, TiN, and WC having uniform grain size in the range of 5 to 100 nm. This was accomplished by introducing a couple of manolayers of materials with high surface and have a weak interaction with the substrate. The hardness measurements of these well-characterized specimens with controlled microstructures show that hardness initially increases with decreasing grain size following the well-known Hall-Petch relationship (H∝d−½). However, there is a critical grain size below which the hardness decreases with decreasing grain size. The experimental evidence for this softening of nanocrystalline materials at very small grain sizes (referred as reverse Hall-Petch effect) is presented for the first time. Most of the plastic deformation in our model is envisioned to be due to a large number of small “sliding events” associated with grain boundary shear or grain boundary sliding. This grain-size dependence of hardness can be used to create functionally gradient materials for improved adhesion and wear among other improved properties.


2014 ◽  
Vol 29 (2) ◽  
pp. 277-287 ◽  
Author(s):  
Lu Wang ◽  
Jianqiu Zhou ◽  
Shu Zhang ◽  
Yingguang Liu ◽  
Hongxi Liu ◽  
...  

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