INTEGRATED CIRCUIT CHANNEL ROUTING USING A PARETO-OPTIMAL GENETIC ALGORITHM

2012 ◽  
Vol 21 (05) ◽  
pp. 1250041
Author(s):  
THEODORE W. MANIKAS

An important part of the integrated circuit design process is the channel routing stage, which determines how to interconnect components that are arranged in sets of rows. The channel routing problem has been shown to be NP-complete, thus this problem is often solved using genetic algorithms. The traditional objective for most channel routers is to minimize total area required to complete routing. However, another important objective is to minimize signal propagation delays in the circuit. This paper describes the development of a genetic channel routing algorithm that uses a Pareto-optimal approach to accommodate both objectives. When compared to the traditional channel routing approach, the new channel router produced layouts with decreased signal delay, while still minimizing routing area.

VLSI Design ◽  
1994 ◽  
Vol 1 (3) ◽  
pp. 233-242 ◽  
Author(s):  
Xiaoyu Song

Channel routing problem is an important, time consuming and difficult problem in VLSI layout design. In this paper, we consider the two-terminal channel routing problem in a new routing model, called knock-knee diagonal model, where the grid consists of right and left tracks displayed at +45° and –45°. An optimum algorithm is presented, which obtains d + 1 as an upper bound to the channel width, where d is the channel density.


Author(s):  
Hung-Sung Lin ◽  
Ying-Chin Hou ◽  
Juimei Fu ◽  
Mong-Sheng Wu ◽  
Vincent Huang ◽  
...  

Abstract The difficulties in identifying the precise defect location and real leakage path is increasing as the integrated circuit design and process have become more and more complicated in nano scale technology node. Most of the defects causing chip leakage are detectable with only one of the FA (Failure Analysis) tools such as LCD (Liquid Crystal Detection) or PEM (Photon Emission Microscope). However, due to marginality of process-design interaction some defects are often not detectable with only one FA tool [1][2]. This paper present an example of an abnormal power consumption process-design interaction related defect which could only be detected with more advanced FA tools.


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