FABRICATION OF PERIODIC STANDING ROD ARRAYS BY THE SHADOW CONE METHOD

2006 ◽  
Vol 05 (06) ◽  
pp. 815-819 ◽  
Author(s):  
HIROFUMI TANAKA ◽  
PAUL S. WEISS ◽  
MARK W. HORN
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Low Cost ◽  
Industrial Applications ◽  
Silicon Substrates ◽  
Simple Method ◽  
Periodic Arrays

A simple method for fabricating periodic arrays of high aspect ratio (1:20) standing nanorods on silicon substrates is described. It is based on shadow deposition onto periodically arranged arrays of mini-rods on a rotating sample stage. Consequently, such nanostructures can be prepared on relatively large areas and at low cost, making the method suitable for industrial applications.

EFAB: High Aspect Ratio, Arbitrary 3-D Metal Microstructures Using a Low-Cost Automated Batch Process

1999 ◽  
Author(s):  
Fan-Gang Tseng ◽  
Gang Zhang ◽  
Uri Frodis ◽  
Adam Cohen ◽  
Florian Mansfeld ◽  
...  
Keyword(s):  
Low Temperature ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Low Cost ◽  
Batch Process ◽  
Unlimited Number ◽  
Metal Layers ◽  
Electrochemical Fabrication ◽  
Low Temperature Process

Abstract EFAB (“Electrochemical FABrication”) is a new micromachining process utilizing an innovative “Instant Masking” (IM) technique to electrochemically deposit an unlimited number of metal layers for microfabrication. Through this approach, high-aspect-ratio microstructures with arbitrary 3-D geometry can be rapidly and automatically batch-fabricated at low temperature (< 60 °C) using an inexpensive desktop machine. IC-MEMS integration can also be carried out by this low temperature process.

Technology chain for production of low-cost high aspect ratio optical structures

2007 ◽  
pp. 658-662
Author(s):  
R. Krajewski ◽  
J. Krezel ◽  
M. Kujawinska ◽  
O. Parriaux ◽  
S. Tonchev ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Low Cost

High aspect ratio hydrogenation-assisted lateral etching of (1 0 0) silicon substrates

2011 ◽  
Vol 21 (7) ◽  
pp. 074003 ◽  
Author(s):  
M Kayyalha ◽  
J Naghsh Nilchi ◽  
A Ebrahimi ◽  
S Mohajerzadeh
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Silicon Substrates

Wetting Challenges in Cleaning of High Aspect Ratio Nano-Structures

2012 ◽  
Vol 195 ◽  
pp. 235-238 ◽  
Author(s):  
Xiu Mei Xu ◽  
Guy Vereecke ◽  
Erik van den Hoogen ◽  
Jens Smeers ◽  
Silvia Armini ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
New Technology ◽  
Critical Issue ◽  
Silicon Substrates ◽  
Wetting Properties ◽  
Nano Structures ◽  
Wet Processing ◽  
Semiconductor Fabrication ◽  
Technology Nodes

In semiconductor fabrication, pattern collapse of high aspect ratio structures after wet processing has been a critical issue and attracted a lot of interest. On the other hand, very little attention is spent on the potential wetting issues as feature dimensions are continuously scaled down and novel materials with different wetting properties are used in new technology nodes. In this work we investigate the wettability of nanopatterned silicon substrates with different surface modifications.

Multi-Layer Photopolymer Micromachining

2005 ◽  
Vol 872 ◽  
Author(s):  
J. R. Huang ◽  
B. Bai ◽  
J. Shaw ◽  
T. N. Jackson ◽  
C. Y. Wei ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Integrated Circuits ◽  
High Aspect Ratio ◽  
Low Cost ◽  
Solution Process ◽  
Microfluidic Channel ◽  
Width Ratio ◽  
Large Area ◽  
Additive Process ◽  
Infiltration Process

AbstractThis paper presents a novel method to create and integrate micro-machined devices and high aspect-ratio (height-to-width ratio) microstructures in which the microstructures are built up using multiple layers of photopolymer film and/or viscous solution. Very high aspect-ratio 2-and 3-dimensional (2-D and 3-D) microstructures were constructed by stacking photo-imageable polymer films. Such films may be dry films applied by lamination or solution layers applied by bar coating, or doctor blade coating. Photolithography is used in both cases to define the microstructure. This additive process of thin-film micromachining facilitates high aspect-ratio microstructure fabrication. We have demonstrated structures of up to 12-layers comprising 2-D arrays of deep trenches (180 μm deep and 25 μm wide) and a 2-layer SU-8 micro-trench array with an aspect ratio up to 36 on glass substrates. Miniaturized structures of interconnected reservoirs as small as 50 μm × 50 μm × 15 μm (∼38 pico liter storage capacity) are also being fabricated, along with a novel 5-layer microfluidic channel array and a vacuum-infiltration process for fluid manipulation. This method has the potential to create functional large-area micro-devices at low-cost and with increased device flexibility, durability, prototyping speed, and reduced process complexity for applications in optoelectronics, integrated detectors, and bio-devices. The novel multi-layer photopolymer dry film and solution process also allows microstructures in micro-electro-mechanical systems (MEMS) to be built with ease and provides the functionality of MEMS integration with electronic devices and integrated circuits (ICs).

Fabrication of ultra-high-aspect-ratio nano-walls and nano-structures on silicon substrates

2020 ◽  
Vol 30 (12) ◽  
pp. 125008
Author(s):  
Mahsa Pournia ◽  
Seyed Ahmadreza Firoozabadi ◽  
Morteza Fathipour ◽  
Mohammadreza Kolahdouz
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Silicon Substrates ◽  
Nano Structures

SU-8 Processing on a Variety of Substrates

1999 ◽  
Vol 605 ◽  
Author(s):  
Yuh-Min Chiang ◽  
Mark Bachman ◽  
Hung-Pin Chang ◽  
Charles Chu ◽  
G. P. Li
Keyword(s):  
Surface Tension ◽  
Aspect Ratio ◽  
Surface Properties ◽  
Silicon Wafer ◽  
Environmental Conditions ◽  
High Aspect Ratio ◽  
Silicon Substrates

AbstractSU-8 has become a popular material for micromachining high aspect ratio structures. Typically, SU-8 is spun on a polished silicon wafer for processing. After patterning, the SU-8 is used for micromachined structures directly (such as fluidic channels) or as a mold for electroforming. Non-silicon substrates offer the possibility of cheaper processing, improved mold designs, and multi-material devices. Successful SU-8 processing depends strongly on surface properties of the substrate itself as well as environmental conditions during the processing. We explore the issues involved in transferring SU-8 technology to non-silicon substrates such as glass, plastics and metals. Issues such as wettability, adhesion, and surface tension are explored in this study. The findings indicate the merits of non-spinning approaches, such as dipping, spraying, and brushing and point to new SU-8 processes.

A fast, precise and low-cost replication technique for nano- and high-aspect-ratio structures of biological and artificial surfaces

2008 ◽  
Vol 3 (4) ◽  
pp. 046002 ◽  
Author(s):  
Kerstin Koch ◽  
Anna Julia Schulte ◽  
Angelika Fischer ◽  
Stanislav N Gorb ◽  
Wilhelm Barthlott
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Low Cost ◽  
Artificial Surfaces ◽  
Replication Technique
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