A general purpose graphic system for computer aided design

1979 ◽  
Vol 13 (2) ◽  
pp. 25-32 ◽  
Author(s):  
Sakae Uno ◽  
Hideo Matsuka
1998 ◽  
Vol 120 (11) ◽  
pp. 66-71 ◽  
Author(s):  
Mar Halpern

This article examines the growing usefulness of computer-aided engineering (CAE) programs for the design of electronics packaging. CAE combined with expert interpretation, can help manufacturers quickly satisfy demand for increasingly small yet reliable products. Currently, three classes of software specifically support electronics packaging design: integrated computer-aided design (CAD) CAE software, general-purpose CAE software, and specialty CAE software solutions. The integrated CAE software emphasizes automatic creation and updating of finite-element-analysis (FEA) models based on CAD geometry. The effectiveness of this associativity between CAD and FEA depends on the product behavior to be evaluated and the quality of implementation. CAE simulation can calculate the maximum acceptable loads on pins, as well as the vibration characteristics of components. Solids-based CAD helps detect interference problems across components, as in these exploded views of a disc drive and a headset. While several general-purpose CAE suppliers permit engineers to build customized environments for automating model creation, specialty suppliers such as Pacific Numerix deliver the specific automated capabilities and connector libraries.


Author(s):  
J McCartney ◽  
B K Hinds

In the apparel field, there is the problem of creating a design with respect to an underlying standard form. Instead of applying general-purpose three-dimensional computer aided design systems to such tasks it is proposed that design can be carried more efficiently with bespoke design systems. These can be targeted to deal with the problems of accurately defining the offset surfaces which comprise the garment. Such a system is introduced and the methods of data entry are discussed. Position on the three-dimensional form is determined using a digitizer tablet and fit with respect to the form is specified by an offset dimension. It is shown that complex garment pieces with variable fit can be quickly specified within the system.


2010 ◽  
Vol 56 (3) ◽  
pp. 307-318
Author(s):  
Jacek Wojciechowski ◽  
Juliusz Modzelewski ◽  
Jan Ogrodzki ◽  
Leszek Opalski ◽  
Krzysztof Zamłyński

Computer-Aided Multi-Layer Design of Switch-Mode Power CircuitsSwitch-mode circuits are used as power processors, e.g. DC/DC converters, synchronous rectifiers, high-frequency resonant power amplifiers. Their efficient computer-aided design is a technical problem only partly resolved so far. This paper presents a multi-layer CAD methodology for switch-mode power circuits. It discusses several levels of modeling of switching devices. First rough design verification is feasible using ideal switch models. It gives a satisfactory first-cut design. Then full models and general-purpose tools provide more exact verification of the design. At this exact step the design procedure makes use of interactive improvement followed by automatic optimization of some quality based objective functions. The proposed methodology is shown to be especially useful for high power class-D voltage-switching resonant amplifiers, where the so far used experimental optimization is extremely cost consuming.


The complexity of integrated circuits continues to grow, and chips with over 10 8 transistors will be in widespread use by the late 1990s. These chips will combine general purpose processors with subsystems for communications and other specialized tasks. They will be far too complex for the design to be tested, and manufacturing volumes will be far too high for the design to be wrong! Mathematical techniques have already been applied to the design of parts of VLSI chips. Most of this work is experimental, and requires an unusual combination of engineering, mathematical and programming skills. Sometimes new theoretical work is needed, and specialized tools may have to be constructed. Despite these difficulties, mathematical techniques are playing an important role in the design of microprocessors at Inmos, and techniques suitable for incorporation in standard computer-aided design systems are emerging.


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