Determination of Diffusion Boundary Layers and Copper Thickness Uniformity in Plating Tools Designed for 3-D Interconnect and Packaging Applications

2019 ◽  
Vol 6 (8) ◽  
pp. 185-197
Author(s):  
Heather McCrabb ◽  
Holly Garich ◽  
Larry Gebhart ◽  
Maria Inman ◽  
E. Jennings Taylor ◽  
...  
1996 ◽  
Vol 119 (1) ◽  
pp. 81-90 ◽  
Author(s):  
L. Dammak ◽  
C. Larchet ◽  
B. Auclair ◽  
J.A. Manzanares ◽  
S. Mafé

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