Fabrication of Thick-film Silicon-on-Insulator by Separation by Implanted Oxygen Layer Transfer

2019 ◽  
Vol 19 (4) ◽  
pp. 311-316
Author(s):  
Xing Wei ◽  
Ai Min Wu ◽  
Bo Zhang ◽  
Miao Zhang ◽  
Xi Wang ◽  
...  
2010 ◽  
Vol 157 (1) ◽  
pp. H81 ◽  
Author(s):  
Xing Wei ◽  
Aimin Wu ◽  
Xiang Wang ◽  
Xianyuan Li ◽  
Fei Ye ◽  
...  

Author(s):  
Yasunori Goto ◽  
Hiroomi Eguchi ◽  
Masaru Iida

Abstract In the automotive IC using thick-film silicon on insulator (SOI) semiconductor device, if the gettering capability of a SOI wafer is inadequate, electrical characteristics degradation by metal contamination arises and the yield falls. At this time, an automotive IC was made experimentally for evaluation of the gettering capability as one of the purposes. In this IC, one of the output characteristics varied from the standard, therefore failure analysis was performed, which found trace metal elements as one of the causes. By making full use of 3D perspective, it is possible to fabricate a site-specific sample into 0.1 micrometre in thickness without missing a failure point that has very minute quantities of contaminant in a semiconductor device. Using energy dispersive X-ray, it is possible to detect trace metal contamination at levels 1E12 atoms per sq cm. that are conventionally detected only by trace element analysis.


2003 ◽  
Vol 336 (3-4) ◽  
pp. 344-348 ◽  
Author(s):  
Xinyun Xie ◽  
Weili Liu ◽  
Qing Lin ◽  
Chuanling Men ◽  
Chenglu Lin

2004 ◽  
Vol 58 (3-4) ◽  
pp. 465-469
Author(s):  
Xinyun Xie ◽  
Qing Lin ◽  
Weili Liu ◽  
Chenglu Lin

2002 ◽  
Vol 245 (3-4) ◽  
pp. 207-211 ◽  
Author(s):  
Xinyun Xie ◽  
Ninglin Zhang ◽  
Chuanling Men ◽  
Weili Liu ◽  
Qing Lin ◽  
...  

Author(s):  
Xing Wei ◽  
Bo Zhang ◽  
Meng Chen ◽  
Miao Zhang ◽  
Xi Wang ◽  
...  

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