Structural, Elemental, and Chemical Complex Defects in Silicon and Their Impact on Silicon Devices

2005 ◽  
Vol 14 (1) ◽  
pp. 34-36
Author(s):  
Andrei Istratov ◽  
Eicke Weber
1998 ◽  
Author(s):  
I. De Wolf ◽  
G. Groeseneken ◽  
H.E. Maes ◽  
M. Bolt ◽  
K. Barla ◽  
...  

Abstract It is shown, using micro-Raman spectroscopy, that Shallow Trench Isolation introduces high stresses in the active area of silicon devices when wet oxidation steps are used. These stresses result in defect formation in the active area, leading to high diode leakage currents. The stress levels are highest near the outer edges of line structures and at square structures. They also increase with decreasing active area dimensions.


2021 ◽  
Vol 1889 (2) ◽  
pp. 022057
Author(s):  
Lochin Tilloev ◽  
Khamro Dustov ◽  
Azam Alimov ◽  
Farkhod Bobokulov ◽  
Furkat Ruziev
Keyword(s):  

2004 ◽  
Vol 85 (17) ◽  
pp. 3660-3662 ◽  
Author(s):  
P.-C. Lv ◽  
R. T. Troeger ◽  
S. Kim ◽  
S. K. Ray ◽  
K. W. Goossen ◽  
...  

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