Impact of Temperature on Structure Deformation for Monolithic Inter-Tier vias In Monolithic 3D IC Packaging System
Gurijala Deepthi
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Girish Kumar Mekala
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Madhavi Tatineni
2009 ◽
Vol 27
(3)
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pp. 4-9
Seung-Min Hyun
◽
Chang-Woo Lee
2016 ◽
Vol 61
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pp. 64-70
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Fa Xing Che
◽
Xiaowu Zhang
◽
Jong-Kai Lin
Satish G. Kandlikar
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Amlan Ganguly
2011 ◽
Vol 51
(3)
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pp. 517-523
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Y. C. Chao
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P. S. Huang
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H. T. Keng
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M. Y. Tsai
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P. C. Lin
2014 ◽
Vol 120
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pp. 85-89
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M. Lofrano
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B. Vandevelde
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M. Gonzalez
Ranjith Samuel E. John
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Herman Meynen
◽
Sheng Wang
◽
Peng-Fei Fu
◽
Craig Yeakle
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...
2012 ◽
Vol 134
(1)
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pp. 340-344
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Ruo-Wei Yang
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Yuan-Wei Chang
◽
Wei-Chi Sung
◽
Chih Chen
2016 ◽
Vol 59
◽
pp. 84-94
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Hsien-Chie Cheng
◽
Tzu-Chin Huang
◽
Po-Wen Hwang
◽
Wen-Hwa Chen