(Invited) Copper Superconformal Filling of High Aspect Ratio through Glass Holes Using MTT Additive: Plug Formation, Quality of the Fill, and MTT Reduction Behavior

2018 ◽  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Reduction Behavior ◽  
Mtt Reduction ◽  
Plug Formation

scholarly journals Optical Detection Method for High Aspect Ratio Microstructures

Micromachines ◽  
2020 ◽  
Vol 11 (3) ◽  
pp. 296
Author(s):  
Wenbin Wei ◽  
Shuangyue Hou ◽  
Zhao Wu ◽  
Yue Hu ◽  
Yi Wang ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Visible Light ◽  
High Aspect Ratio ◽  
Detection Method ◽  
Optical Detection ◽  
System Parameters ◽  
Efficient Detection ◽  
Reflection Of Light ◽  
Application Fields

High aspect ratio microstructures (HARMS) are of great importance for many application fields. Many defects are generated during the fabrication processes, especially in line microstructures, and it is necessary to examine the quality of the structures after each process. However, there is no suitable efficient nondestructive detection method to monitor microstructures during the fabrication processes. In this paper, an optical detection method capable of detecting the structures by analyzing the reflection of light on the line HARMS is proposed. According to the image of reflected visible light, this method can determine whether there are defects in structures, so as to realize efficient detection. Preliminary simulations and experiments have been performed to confirm the feasibility and validity of the proposed method for detecting line microstructures. This method is expected to obtain more information about microstructures by further optimizing system parameters.

Methodologies for Quantifying FIB “Milling Acuity”

2009 ◽  
Author(s):  
Chad Rue
Keyword(s):  
Aspect Ratio ◽  
Real World ◽  
High Aspect Ratio ◽  
Process Development ◽  
Spot Size ◽  
Performance Tests ◽  
Imaging Resolution ◽  
Measuring Scheme ◽  
Column Performance

Abstract FIB column performance can be difficult to evaluate, and the traditional metrics of imaging resolution and minimum spot size give little indication of how a FIB system will perform its intended daily tasks. A series of supplemental FIB performance tests is proposed to quantify “milling acuity” under real-world conditions. A quantitative measuring scheme for evaluating the quality of High Aspect Ratio (HAR) vias is proposed, and an example is shown in which the HAR measuring scheme can be used for process development.

Confocal optoelectronic holography microscope for materials and structural characterization of MEMS

2002 ◽  
Vol 738 ◽  
Author(s):  
Cosme Furlong ◽  
Adam M. Siegel ◽  
Ryszard J. Pryputniewicz
Keyword(s):  
Aspect Ratio ◽  
Structural Characterization ◽  
High Aspect Ratio ◽  
Numerical Aperture ◽  
Magnification Factor ◽  
Optical Components ◽  
Measurement Resolution ◽  
Image Digitization

ABSTRACTIn this paper, we describe confocal optoelectronic holography microscopy (COEHM) technique specifically being developed for characterizing the shape of MEMS and microelectronics. This is particularly important because shape is directly related to the functionality, performance, and integrity of the microstructures of interest. A specific feature of COEHM is that it allows characterization of high aspect ratio MEMS and microelectronics. Representative applications demonstrating the capabilities of COEHM are presented. It is shown that measurement resolution is highly dependent on the numerical aperture (NA) of the optical components comprising COEHM and on the quality of image digitization. By utilizing optical components characterized by a magnification factor of 50x and a NA of 0.45, measurement resolution of 25 nm is achieved. The resolution is increased to 8 nm when utilizing optical components characterized by a magnification factor of 100x and a NA of 0.73.

scholarly journals Using Stereolithographic Printing to Manufacture Monolithic Microfluidic Devices with an Extremely High Aspect Ratio

Polymers ◽  
2021 ◽  
Vol 13 (21) ◽  
pp. 3750
Author(s):  
Pin-Chuan Chen ◽  
Po-Tsang Chen ◽  
Tuan Ngoc Anh Vo
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Dimensional Accuracy ◽  
Microfluidic Devices ◽  
Oxygen Inhibition ◽  
Dimensional Precision ◽  
Inner Surface ◽  
Inhibition Process ◽  
High Degree

Stereolithographic printing (SL) is widely used to create mini/microfluidic devices; however, the formation of microchannels smaller than 500 μm with good inner surface quality is still challenging due to the printing resolution of current commercial printers and the z-overcure error and scalloping phenomena. In the current study, we used SL printing to create microchannels with the aim of achieving a high degree of dimensional precision and a high-quality microchannel inner surface. Extensive experiments were performed and our results revealed the following: (1) the SL printing of microchannels can be implemented in three steps including channel layer printing, an oxygen inhibition process, and roof layer printing; (2) printing thickness should be reduced to minimize the scalloping phenomenon, which significantly improves dimensional accuracy and the quality of inner microchannel surfaces; (3) the inclusion of an oxygen inhibition step is a critical and efficient approach to suppressing the z-overcure error in order to eliminate the formation of in-channel obstructions; (4) microchannels with an extremely high aspect ratio of 40:1 (4000 μm in height and 100 μm in width) can be successfully manufactured within one hour by following the three-step printing process.

Fabrication of High Aspect Ratio SU-8 Microstructures on Piezoelectric Transducers

2011 ◽  
Vol 110-116 ◽  
pp. 3127-3131
Author(s):  
N. Ramakrishnan ◽  
Harshal B. Nemade ◽  
Roy Paily Palathinkal
Keyword(s):  
Thin Film ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Piezoelectric Transducers ◽  
Fabrication Process ◽  
Metallic Substrates ◽  
Micro Structures ◽  
Piezoelectric Substrate

A methodology to fabricate high aspect ratio (HAR) SU-8 micro structures on piezoelectric and metallic substrates is presented. In this work, several fabrication trials were carried out to optimize the SU-8 fabrication process. The fabrication recipe mentioned in the SU-8 (Microchem, USA) datasheet is employed for the initial fabrication trials. The SU-8 structures (micropillars) fabricated during these trials resulted in poor bonding with the surface of piezoelectric substrate. In the later trials a thin film of OmniCoat (Microchem, USA) is coated over the substrate before coating the SU-8 film to improve the adhesion quality of the SU-8 micropillars to the substrate. The fabrication methodology used during the trails and results on the quality of the fabricated HAR SU-8 pillars are discussed in the paper.

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