Annealing Characteristics of Nano-Grained Oxygen Free Copper Processed by Accumulative Roll-Bonding Process
2006 ◽
Vol 6
(11)
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pp. 3661-3664
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Keyword(s):
Annealing characteristics of nano-grained oxygen free copper processed by accumulative roll-bonding (ARB) were studied. A nano-grained oxygen free copper fabricated by 8 cycles of the ARB was annealed at various temperatures ranging from 100 to 300 °C for 0.6 ks. TEM observation revealed that the ultrafine grains still sustained up to 150 °C, however above 200 °C they were replaced by equiaxed and coarse grains due to an occurrence of the static recrystallization. The tensile strength of the copper decreased largely above 200 °C. These annealing characteristics of the copper were compared with those of a commercially pure aluminum.
2012 ◽
Vol 47
(1)
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pp. 19-24
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2009 ◽
Vol 19
(8)
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pp. 432-436
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2014 ◽
Vol 2014.67
(0)
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pp. _401-1_-_401-2_
2015 ◽
Vol 631
◽
pp. 104-119
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2011 ◽
Vol 509
(14)
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pp. 4696-4700
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2016 ◽
Vol 650
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pp. 8-14
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