A New Class of High-Capacity, Resource-Rich Field-Programmable Gate Arrays Enabled by Three- Dimensional Integration Chip-Stacked Silicon Interconnect Technology

2018 ◽  
pp. 41-69
Author(s):  
Suresh Ramalingam ◽  
Henley Liu ◽  
Myongseob Kim ◽  
Boon Ang ◽  
Woon-Seong Kwon ◽  
...  
Sign in / Sign up

Export Citation Format

Share Document