3D Integration in VLSI Circuits
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Published By CRC Press

9781315200699

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Novel Platforms and Applications Using Three-Dimensional and Heterogeneous Integration Technologies

3D Integration in VLSI Circuits ◽

10.1201/9781315200699-8 ◽

2018 ◽

pp. 185-210

Author(s):

Kuan-Neng Chen ◽

Ting-Yang Yu ◽

Yu-Chen Hu ◽

Cheng-Hsien Lu

Keyword(s):

Three Dimensional ◽

Heterogeneous Integration

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Wafer-Level Three-Dimensional Integration Using Bumpless Interconnects and Ultrathinning

3D Integration in VLSI Circuits ◽

10.1201/9781315200699-5 ◽

2018 ◽

pp. 85-115

Author(s):

Takayuki Ohba

Keyword(s):

Three Dimensional ◽

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Toward Three-Dimensional High Density

3D Integration in VLSI Circuits ◽

10.1201/9781315200699-7 ◽

2018 ◽

pp. 145-183

Author(s):

S. Cheramy ◽

A. Jouve ◽

C. Fenouillet-Beranger ◽

P. Vivet ◽

L. Di Cioccio

Keyword(s):

Three Dimensional ◽

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Challenges in 3D Integration

3D Integration in VLSI Circuits ◽

10.1201/9781315200699-4 ◽

2018 ◽

pp. 71-83

Author(s):

M. Koyanagi ◽

T. Fukushima ◽

T. Tanaka

Keyword(s):

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A New Class of High-Capacity, Resource-Rich Field-Programmable Gate Arrays Enabled by Three- Dimensional Integration Chip-Stacked Silicon Interconnect Technology

3D Integration in VLSI Circuits ◽

10.1201/9781315200699-3 ◽

2018 ◽

pp. 41-69

Author(s):

Suresh Ramalingam ◽

Henley Liu ◽

Myongseob Kim ◽

Boon Ang ◽

Woon-Seong Kwon ◽

...

Keyword(s):

Three Dimensional ◽

High Capacity ◽

Field Programmable Gate Arrays ◽

Gate Arrays ◽

New Class ◽

Field Programmable ◽

Programmable Gate Arrays ◽

Interconnect Technology

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Three-Dimensional System-in-Package for Application-Specific Integrated Circuit and Three-Dimensional Dynamic Random-Access Memory Integration

3D Integration in VLSI Circuits ◽

10.1201/9781315200699-2 ◽

2018 ◽

pp. 15-39

Author(s):

Li Li

Keyword(s):

Integrated Circuit ◽

Three Dimensional ◽

Random Access ◽

Random Access Memory ◽

Dimensional System ◽

Access Memory ◽

Memory Integration ◽

Application Specific Integrated Circuit ◽

Application Specific ◽

Three Dimensional System

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Three-Dimensional Integration: Technology and Design

3D Integration in VLSI Circuits ◽

10.1201/9781315200699-1 ◽

2018 ◽

pp. 1-13

Author(s):

P. Franzon

Keyword(s):

Three Dimensional ◽

Integration Technology ◽

Technology And Design

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Three-Dimensional Integration Stacking Technologies for High-Volume Manufacturing by Use of Wafer-Level Oxide-Bonding Integration

3D Integration in VLSI Circuits ◽

10.1201/9781315200699-6 ◽

2018 ◽

pp. 117-143

Author(s):

Spyridon Skordas ◽

Katsuyuki Sakuma ◽

Kevin Winstel ◽

Chandrasekharan Kothandaraman

Keyword(s):

Three Dimensional ◽

High Volume ◽

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