Furnace Temperature Curve Model of an Electronic Reflow Furnace

2021 ◽  
Vol 10 (08) ◽  
pp. 2775-2783
Author(s):  
艳玲 张
2021 ◽  
Vol 769 (4) ◽  
pp. 042089
Author(s):  
Huilong Chen ◽  
Haihua Luo ◽  
Shizeng Wu

2021 ◽  
Vol 2083 (4) ◽  
pp. 042025
Author(s):  
Huiting Sun ◽  
Hongkun Liu ◽  
Ying Wang

Abstract Reflux welding is widely used in SMT (surface patch technology) During this production process, the quality of the product is essential to maintain the temperature and the furnace speed required by the process. The furnace temperature curve in the furnace is an important form of reaction welding process. In order to improve the process efficiency of the return furnace, the heating welding process model is established based on the Fourier heat conduction law,1 D heat conduction model and Newton cooling law and draws the furnace temperature curve model. Then, the upper boundary of the conveyor speed using the boundary analysis and multiple target planning, and further explore the research and optimization direction of subsequent process flow. At the same time, this paper examines and analyzes the modeling process and results, and effectively demonstrates the scientific nature and accuracy of the model. Finally, the paper analyzes the significance of the above model and research in chip processing.


2021 ◽  
Vol 2012 (1) ◽  
pp. 012070
Author(s):  
Jianting Xue ◽  
Xuerong Wei ◽  
Qiang Liu ◽  
Yuanyuan Mao

2021 ◽  
Vol 2012 (1) ◽  
pp. 012091
Author(s):  
Jieya Zhang ◽  
Yijun Jing ◽  
Yongzheng Chao ◽  
Yuanyuan Mao

2021 ◽  
Vol 1903 (1) ◽  
pp. 012030
Author(s):  
Xu Wang ◽  
Pengju Sun ◽  
Huibin Bai ◽  
Dongqing Zhang

2021 ◽  
Vol 233 ◽  
pp. 04004
Author(s):  
Qiaoyun Lei ◽  
Ziyou Zhang ◽  
Songyi Zhuo ◽  
Kangju Lin

Insights into the mechanism of reflow soldering temperature curve, a mathematical model of the temperature change of the circuit board surface is established. The heat transfer methods, heat radiation and heat convection is analyzed in detail. The curve of air temperature inside the reflow furnace is solved by establishing an one-dimensional heat conduction model and fitting coefficients. The heat radiation received by the circuit board mainly comes from the small temperature zone. Depending on the area where the circuit board is located, heat radiation is itemized into 3 types: heat radiation in the gap, the temperature zone and the adjacent temperature zone of the area before and after the furnace. The impacts of heat radiation is weighted and analyzed by relative distance. For coefficients, analyzing and fitting is further discussed.


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