scholarly journals Research on Furnace Temperature Curve Based on Heat Convection and Heat Radiation

2021 ◽  
Vol 233 ◽  
pp. 04004
Author(s):  
Qiaoyun Lei ◽  
Ziyou Zhang ◽  
Songyi Zhuo ◽  
Kangju Lin
Keyword(s):  
Temperature Curve ◽  
Heat Convection ◽  
Circuit Board ◽  
Heat Radiation ◽  
Temperature Zone ◽  
Furnace Temperature ◽  
Conduction Model ◽  
Soldering Temperature ◽  
Board Surface ◽  
Before And After

Insights into the mechanism of reflow soldering temperature curve, a mathematical model of the temperature change of the circuit board surface is established. The heat transfer methods, heat radiation and heat convection is analyzed in detail. The curve of air temperature inside the reflow furnace is solved by establishing an one-dimensional heat conduction model and fitting coefficients. The heat radiation received by the circuit board mainly comes from the small temperature zone. Depending on the area where the circuit board is located, heat radiation is itemized into 3 types: heat radiation in the gap, the temperature zone and the adjacent temperature zone of the area before and after the furnace. The impacts of heat radiation is weighted and analyzed by relative distance. For coefficients, analyzing and fitting is further discussed.

scholarly journals Modeling analysis and optimization of temperature curve of welding furnace

2021 ◽  
Vol 2083 (4) ◽  
pp. 042025
Author(s):  
Huiting Sun ◽  
Hongkun Liu ◽  
Ying Wang
Keyword(s):  
Heat Conduction ◽  
Process Model ◽  
Welding Process ◽  
Temperature Curve ◽  
Process Efficiency ◽  
Surface Patch ◽  
Furnace Temperature ◽  
Conduction Model ◽  
Modeling Analysis ◽  
Chip Processing

Abstract Reflux welding is widely used in SMT (surface patch technology) During this production process, the quality of the product is essential to maintain the temperature and the furnace speed required by the process. The furnace temperature curve in the furnace is an important form of reaction welding process. In order to improve the process efficiency of the return furnace, the heating welding process model is established based on the Fourier heat conduction law,1 D heat conduction model and Newton cooling law and draws the furnace temperature curve model. Then, the upper boundary of the conveyor speed using the boundary analysis and multiple target planning, and further explore the research and optimization direction of subsequent process flow. At the same time, this paper examines and analyzes the modeling process and results, and effectively demonstrates the scientific nature and accuracy of the model. Finally, the paper analyzes the significance of the above model and research in chip processing.

scholarly journals Research forecasting model to solve the problem of marketing needs of enterprises

2021 ◽  
Vol 236 ◽  
pp. 04041
Author(s):  
Mo Jing-lan ◽  
Wu Yang-yang ◽  
Wang Yao ◽  
Huang Yu-ting
Keyword(s):  
Temperature Change ◽  
Temperature Curve ◽  
Circuit Board ◽  
Optimization Models ◽  
Forecasting Model ◽  
Prediction Methods ◽  
Actual Process ◽  
Furnace Temperature ◽  
The Core

This essay focuses on the temperature variation law of the center of the target board soldering area at a certain position when the reflow oven starts working as the core discussion. Using the principle of heat conduction, Fourier's law to solve the problem of temperature values and temperature change laws in the center of the soldering area of the target circuit board at different locations under set conditions. As in the actual process, the temperature change in the center of the soldering area is limited to certain conditions, we can use the target planning, prediction methods, to build a model to solve the maximum problem. At the same time we need to consider the quality of the target circuit board, the use of neural networks, genetic algorithms to establish optimization models for target optimization, and ultimately the optimal furnace temperature curve.

Application of plasma cleaning process in MEMS filter micro-assembly

2020 ◽  
Vol 34 (24) ◽  
pp. 2050256
Author(s):  
Yuhua Hu ◽  
Yan Zhang ◽  
Qin Zhou
Keyword(s):  
Radio Frequency ◽  
Wire Bonding ◽  
Circuit Board ◽  
Plasma Cleaning ◽  
Cleaning Process ◽  
Micro Assembly ◽  
Die Attach ◽  
Before And After ◽  
Low Efficiency ◽  
Mems Filter

To solve the problems of low efficiency and high void rate in the process of the MEMS filter (die) attach and increase the strength of wire bonding between the die and microwave circuit board, plasma cleaning process was introduced in the micro-assembly process of the MEMS filter switch module. The spreading area of the solder melted on the copper was analyzed before and after the plasma cleaning process. Process parameters including plasma flow, radio frequency time and radio frequency power were optimized by the orthogonal test. It is demonstrated that the plasma cleaning process is effective to decrease the void rates in die attach and enhance the wire bonding strength, thus improve the reliability of the MEMS filter module micro-assembly.

Thermal Performance of Microelectronic Substrates With Submillimeter Integrated Vapor Chamber

2019 ◽  
Vol 141 (5) ◽  
Author(s):  
Sangbeom Cho ◽  
Yogendra Joshi
Keyword(s):  
Heat Transfer ◽  
Thermal Performance ◽  
Printed Circuit Board ◽  
Mechanical Design ◽  
Three Dimensional ◽  
Circuit Board ◽  
Working Fluid ◽  
Vapor Chamber ◽  
Conduction Model ◽  
Printed Circuit

We develop a vapor chamber integrated with a microelectronic packaging substrate and characterize its heat transfer performance. A prototype of vapor chamber integrated printed circuit board (PCB) is fabricated through successful completion of the following tasks: patterning copper micropillar wick structures on PCB, mechanical design and fabrication of condenser, device sealing, and device vacuuming and charging with working fluid. Two prototype vapor chambers with distinct micropillar array designs are fabricated, and their thermal performance tested under various heat inputs supplied from a 2 mm × 2 mm heat source. Thermal performance of the device improves with heat inputs, with the maximum performance of ∼20% over copper plated PCB with the same thickness. A three-dimensional computational fluid dynamics/heat transfer (CFD/HT) numerical model of the vapor chamber, coupled with the conduction model of the packaging substrate is developed, and the results are compared with test data.

Numerical Analysis of Multi-Layer Continuous Diffusion Furnace Door Gas Curtain

2013 ◽  
Vol 367 ◽  
pp. 462-465
Author(s):  
Sheng Cai Zhang ◽  
Gui Qin Li ◽  
Li Xin Lu ◽  
Peter Mitrouchev ◽  
Cheng Gang Wang
Keyword(s):  
Numerical Analysis ◽  
Heat Loss ◽  
Thermal Load ◽  
Gas Flow ◽  
Time Varying ◽  
Main Aspect ◽  
Temperature Zone ◽  
Furnace Temperature ◽  
Air Curtain ◽  
Reduce Heat Loss

Thermal load oozing out through the door is the main aspect of the temperature zone heat loss of continuous diffusion furnace. In this paper, multi-layer gas curtain is designed to seal the furnace door in order to reduce heat loss and ensure furnace temperature to meet requirements in regulation. The unsteady flow is presented to better reflect complex time-varying velocity and temperature of curtain gas. Flow and temperature field of continuous diffusion door with multi-layer air curtain are numerically analyzed by Renault model and experimentally tested. And the influence parameters are tuned and optimized based on the theoretic numerical analysis and experiment results.

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