706 High Accuracy Analysis Method by Only two Pictures for Electric Speckle Pattern Interferometry

2013 ◽  
Vol 2013.88 (0) ◽  
pp. _7-6_
Author(s):  
Takuya INOUE ◽  
Yasuhiko ARAI
Keyword(s):  
Speckle Pattern ◽  
High Accuracy ◽  
Accuracy Analysis ◽  
Analysis Method

821 A High Accuracy Analysis Method for Rotor Vibration Using Equivalent Reduced Model of Solid Model

2012 ◽  
Vol 2012 (0) ◽  
pp. _821-1_-_821-9_
Author(s):  
Toyomi YOSHIDA ◽  
Kazuyuki YAMAGUCHI ◽  
Yohei MAGARA ◽  
Akira ENDO
Keyword(s):  
High Accuracy ◽  
Reduced Model ◽  
Solid Model ◽  
Accuracy Analysis ◽  
Analysis Method ◽  
Rotor Vibration

scholarly journals 3107 Seamless High Accuracy Analysis Method to FOA for adapting the FOA Results

2005 ◽  
Vol 2005.15 (0) ◽  
pp. 441-444
Author(s):  
Yoshiharu Iwata ◽  
Shintaro Hayashi ◽  
Ryohei Satoh ◽  
Kozo Fujimoto
Keyword(s):  
High Accuracy ◽  
Accuracy Analysis ◽  
Analysis Method

An accuracy analysis method for first-order reliability method

2018 ◽  
Vol 233 (12) ◽  
pp. 4319-4327 ◽  
Author(s):  
Zhenzhong Chen ◽  
Zihao Wu ◽  
Xiaoke Li ◽  
Ge Chen ◽  
Guangfeng Chen ◽  
...  
Keyword(s):  
Structural Reliability ◽  
Nonlinear Problems ◽  
Accuracy Analysis ◽  
Analysis Method ◽  
First Order Reliability Method ◽  
First Order ◽  
Reliability Level ◽  
Reliability Method ◽  
Value Range ◽  
Crashworthiness Design

The first-order reliability method is widely used for structural reliability analysis; however, its accuracy would become worse for nonlinear problems. This paper proposes the accuracy analysis method of the first-order reliability method, which considers the worst cases when using the first-order reliability method and gives the possible value range of the probability of safety. The accuracy analysis method can evaluate the reliability level of the first-order reliability method when the failure surfaces are nonlinear. The calculation formula for the possible value range of the probability of safety is proposed, and its trend as the dimensions and reliability rise is also discussed in this paper. A numerical example and a honeycomb crashworthiness design are presented to validate the accuracy of the first-order reliability method, and the results show that they are located within the possible value range proposed in this paper.

scholarly journals Residual Network Structure-based High Accuracy Spectral Analysis Method

2019 ◽  
Vol 15 (11) ◽  
pp. 3090
Author(s):  
Wu Sai ◽  
Wang Zhihui ◽  
Meng Sachura ◽  
Zheng Weijun ◽  
Shao Weiping
Keyword(s):  
Spectral Analysis ◽  
Network Structure ◽  
High Accuracy ◽  
Analysis Method ◽  
Residual Network ◽  
Spectral Analysis Method

High Accuracy Analysis of BPSG Thin Films on Silicon Wafers by X-Ray Wafer Analyzer

1993 ◽  
Vol 37 ◽  
pp. 229-234 ◽  
Author(s):  
H. Kohno ◽  
T. Arai ◽  
Y. Araki ◽  
R. Wilson
Keyword(s):  
Thin Films ◽  
Film Thickness ◽  
Semiconductor Industry ◽  
High Accuracy ◽  
Metallic Alloys ◽  
Accuracy Analysis ◽  
Accurate Analysis ◽  
X Ray ◽  
The Past ◽  
Boron Doped

The wafer analyzer has been used to fulfil many applications needs in the semiconductor industry. The prominent features of the XRF method for the semiconductor industry are:analysis of many types of films, e.g., oxides, silicides and metallic alloys, and simultaneous analysis of film thickness and compositions.In the past, the analysis results of BPSG (Boron-doped Phospho-Silicate Glass) films, with thicknesses greater than 4000 Å, were reported. With the recent increased demand for larger scale and higher quality semiconductor devices (larger than 64 Mbit), more accurate analysis with high precision has been required.

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