OS1209-131 Simultaneous Damage Evaluation of Different Micro-sized Solder Joints under High Current Density

2015 ◽  
Vol 2015 (0) ◽  
pp. _OS1209-13-_OS1209-13
Author(s):  
Xu ZHAO ◽  
Mikio MURAOKA
Keyword(s):  
Current Density ◽  
Solder Joints ◽  
High Current Density ◽  
Damage Evaluation ◽  
High Current

The coupling effects of thermal cycling and high current density on Sn58Bi solder joints

2012 ◽  
Vol 48 (6) ◽  
pp. 2318-2325 ◽  
Author(s):  
Yong Zuo ◽  
Limin Ma ◽  
Sihan Liu ◽  
Ting Wang ◽  
Fu Guo ◽  
...  
Keyword(s):  
Thermal Cycling ◽  
Current Density ◽  
Solder Joints ◽  
High Current Density ◽  
High Current ◽  
Coupling Effects

Effects of high current density on lead-free solder joints of chip-size passive SMD components

2018 ◽  
Vol 30 (2) ◽  
pp. 74-80 ◽  
Author(s):  
Attila Geczy ◽  
Daniel Straubinger ◽  
Andras Kovacs ◽  
Oliver Krammer ◽  
Pavel Mach ◽  
...  
Keyword(s):  
Current Density ◽  
Solder Joints ◽  
High Current Density ◽  
Lead Free ◽  
Lead Free Solder ◽  
High Current ◽  
Chip Size ◽  
Free Solder

Electromigration Behavior in Sn-37Pb and Sn-3.0Ag-0.5Cu Flip-Chip Solder Joints under High Current Density

2008 ◽  
Vol 38 (1) ◽  
pp. 70-77 ◽  
Author(s):  
Sang-Su Ha ◽  
Jong-Woong Kim ◽  
Jeong-Won Yoon ◽  
Sang-Ok Ha ◽  
Seung-Boo Jung
Keyword(s):  
Current Density ◽  
Flip Chip ◽  
Solder Joints ◽  
High Current Density ◽  
High Current

Electromigration Behavior of Cu Core Solder Joints Under High Current Density

2020 ◽  
Vol 16 (6) ◽  
pp. 513-519 ◽  
Author(s):  
Haksan Jeong ◽  
Choong-Jae Lee ◽  
Jae-Ha Kim ◽  
Jae-yeol Son ◽  
Seung-Boo Jung
Keyword(s):  
Current Density ◽  
Solder Joints ◽  
High Current Density ◽  
High Current
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