527 Effct of Processing Conditions on Thermal Conductivity of Diamond Particle Dispersed Copper Matrix Composites Produced by Spark Plasma Sintering (SPS)

2007 ◽  
Vol 2007.15 (0) ◽  
pp. 365-366
Author(s):  
Kiyoshi Mizuuchi ◽  
Kanryu Inoue ◽  
Yasuyuki Agari ◽  
Shinji Yamada ◽  
Masami Sugioka ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Spark Plasma Sintering ◽  
Diamond Particle ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Processing Conditions ◽  
Copper Matrix Composites ◽  
Plasma Sintering ◽  
Spark Plasma

Thermal Properties of Diamond-Particle-Dispersed Cu-Matrix-Composites Fabricated by Spark Plasma Sintering (SPS)

2010 ◽  
Vol 638-642 ◽  
pp. 2115-2120 ◽  
Author(s):  
Kiyoshi Mizuuchi ◽  
Kanryu Inoue ◽  
Yasuyuki Agari ◽  
Shinji Yamada ◽  
Motohiro Tanaka ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Properties ◽  
Spark Plasma Sintering ◽  
Packing Density ◽  
Coefficient Of Thermal Expansion ◽  
Diamond Particle ◽  
Holding Time ◽  
Matrix Composites ◽  
Plasma Sintering ◽  
Spark Plasma

Diamond-particle-dispersed copper (Cu) matrix composites were fabricated from Cu-coated diamond particles by spark plasma sintering (SPS) process, and the microstructure and thermal properties of the composites fabricated were examined. These composites can well be consolidated in a temperature range between 973K and 1173K and scanning electron microscopy detects no reaction at the interface between the diamond particle and the Cu matrix. The relative packing density of the diamond-Cu composite increases with increasing sintering temperature and holding time, reaching 99.2% when sintered at a temperature of 1173K for a holding time of 2.1ks. Thermal conductivity of the diamond-Cu composite containing 43.2 vol. % diamond increases with increasing relative packing density, reaching a maximum (654W/mK) at a relative packing density of 99.2%. This thermal conductivity is 83% the theoretical value estimated by Maxwell-Eucken equation. The coefficient of thermal expansion of the composites falls in the upper line of Kerner’s model, indicating strong bonding between the diamond particle and the Cu matrix in the composite.

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