Cooling Performance of Water-Cooled System for Electronic Devices

In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

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Comparative Effectiveness of Different Phase Change Materials to Improve Cooling Performance of Heat Sinks for Electronic Devices

Applied Sciences ◽

10.3390/app6090226 ◽

2016 ◽

Vol 6 (9) ◽

pp. 226 ◽

Cited By ~ 23

Author(s):

Ahmad Hasan ◽

Hassan Hejase ◽

Shaimaa Abdelbaqi ◽

Ali Assi ◽

Mohammed Hamdan

Keyword(s):

Phase Change ◽

Comparative Effectiveness ◽

Phase Change Materials ◽

Electronic Devices ◽

Heat Sinks ◽

Cooling Performance

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E218 High Heat Flux Cooling for Electronic Devices by Subcooled Flow Boiling : Cooling performance of small multi-channel

Proceedings of thermal engineering conference ◽

10.1299/jsmeptec.2001.0_551 ◽

2001 ◽

Vol 2001 (0) ◽

pp. 551-552

Author(s):

Koichi SUZUKI ◽

Masaomi KOYANAGI ◽

Hiroshi KAWAMURA ◽

Hideo IWASAKI ◽

Koichiro KAWANO ◽

...

Keyword(s):

Heat Flux ◽

Flow Boiling ◽

Electronic Devices ◽

High Heat ◽

High Heat Flux ◽

Subcooled Flow Boiling ◽

Cooling Performance ◽

Subcooled Flow

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Numerical Investigation on Aerodynamic Similitude for Axial Microfan

ASME 2011 Power Conference, Volume 2 ◽

10.1115/power2011-55398 ◽

2011 ◽

Author(s):

Qikun Wang

Keyword(s):

Reynolds Number ◽

Electronic Devices ◽

Poor Performance ◽

Design Approach ◽

Direct Proportion ◽

Cooling Performance ◽

Revolution Speed ◽

New Criterion ◽

Effective Design ◽

Reduced Scale

Axial microfan is widely used as cooling equipment for electronic devices such as PCs. Currently, the PC size becomes smaller and smaller while their operating speed becomes faster and faster, which calls for better cooling performance of axial microfan. As an important and effective design approach, the similitude design has been widely used in the design of large and medium fans, but not yet in the design of axial microfan. The traditional similitude design approach may work well in self-similitude area for Reynolds number, such as the flow inside the large and medium fans, where simple geometric similitude can promise the aerodynamic similitude. But the flow inside the microfan locates in non self-similitude area for Reynolds number, where the traditional similitude design for large and medium fans may be out of work on microfans, which results in poor performance of the microfan designed by the traditional similitude approach. In this paper, the aerodynamic similitude conditions for axial microfan are presented according to the similitude principle for aerodynamics. Compared to large and medium fans in self-similitude area, a new criterion called ‘Chord Reynolds Number Criterion’ suitable to the flow in non self-similitude area is proposed and is numerically validated with discussions on its applicability and limitation. Results indicate that ‘Chord Reynolds Number Criterion’ can well realize the aerodynamic similitude for the axial microfan but it requires that the revolution speed of the impeller should be in direct proportion to the squared minification of the model impeller, so the reduced scale of model impeller shall not be too large, otherwise new non similitude factors may occur again due to too high revolution speed.

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A Review on Development of Liquid Cooling System for Central Processing Unit (CPU)

Journal of Advanced Research in Fluid Mechanics and Thermal Sciences ◽

10.37934/arfmts.78.2.98113 ◽

2020 ◽

Vol 78 (2) ◽

pp. 98-113

Author(s):

Muhammad Arif Harun ◽

Nor Azwadi Che Sidik

Keyword(s):

Heat Transfer ◽

Heat Generation ◽

Heat Transfer Performance ◽

Cooling System ◽

Electronic Devices ◽

Working Fluid ◽

Transfer Performance ◽

Liquid Cooling ◽

Cooling Performance ◽

Liquid Cooling System

Electronic devices are becoming more efficient while getting a smaller size and compact design thus increase heat generation significantly. High heat generation from high technology electronic devices are needed to be cool down or control its temperature to prevent overheating problems. Due to the high cooling performance of liquid cooling, the electronic cooling system is shifting from an air-cooling system to a liquid cooling system. In the past few decades, numerous methods proposed by researchers for the central process unit (CPU) cooling using the liquid system either active cooling or passive cooling system. Other than physical configuration such as heat sink design, different configurations of working fluids are widely been studied by most of the researchers. Different working fluids have different heat transfer performance. Furthermore, a recent study has come out more interesting finding using nanofluid which can enhance heat transfer performance of liquid cooling. Nanofluid is a working fluid that has nanoparticles disperse in the base fluid which can increase the thermal properties of the based fluid. In this paper, comprehensive literature on the type of working fluid used in the respective system and methods of liquid cooling system for CPU including its cooling performance. Furthermore, this review paper discussed the different configuration of the liquid block and also the working fluid that had been used in the CPU cooling system.

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1505 Prediction Accuracy of Cooling Performance at Local Forced Convection Electronic Devices

The Proceedings of The Computational Mechanics Conference ◽

10.1299/jsmecmd.2009.22.712 ◽

2009 ◽

Vol 2009.22 (0) ◽

pp. 712-713

Author(s):

Takashi FUKUE ◽

Kenta YAMAZAKI ◽

Masaru ISHIZUKA ◽

Shinji NAKAGAWA ◽

Tomoyuki HATAKEYAMA ◽

...

Keyword(s):

Forced Convection ◽

Prediction Accuracy ◽

Electronic Devices ◽

Cooling Performance

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Atom-probe analysis of the solid-liquid interface

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100139755 ◽

1995 ◽

Vol 53 ◽

pp. 676-677

Author(s):

J.A. Panitz

Keyword(s):

Molecular Level ◽

Selective Adsorption ◽

Electronic Devices ◽

Atom Probe ◽

Chemical Agent ◽

Hostile Environment ◽

Solid Interface ◽

Solid Liquid Interface ◽

Solid Liquid ◽

Chemically Selective

The first few atomic layers of a solid can form a barrier between its interior and an often hostile environment. Although adsorption at the vacuum-solid interface has been studied in great detail, little is known about adsorption at the liquid-solid interface. Adsorption at a liquid-solid interface is of intrinsic interest, and is of technological importance because it provides a way to coat a surface with monolayer or multilayer structures. A pinhole free monolayer (with a reasonable dielectric constant) could lead to the development of nanoscale capacitors with unique characteristics and lithographic resists that surpass the resolution of their conventional counterparts. Chemically selective adsorption is of particular interest because it can be used to passivate a surface from external modification or change the wear and the lubrication properties of a surface to reflect new and useful properties. Immunochemical adsorption could be used to fabricate novel molecular electronic devices or to construct small, “smart”, unobtrusive sensors with the potential to detect a wide variety of preselected species at the molecular level. These might include a particular carcinogen in the environment, a specific type of explosive, a chemical agent, a virus, or even a tumor in the human body.

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