scholarly journals Fatigue Property of Intermetallic Compound TiAl alloy Coated with ZrO2 and CoNiCrAlY at Elevated Temperature.

1999 ◽  
Vol 65 (629) ◽  
pp. 55-61 ◽  
Author(s):  
Shinichi NUMATA ◽  
Kazutoshi KATAHIRA ◽  
Hideto SUZUKI ◽  
Hirotaka HUKANUMA
Keyword(s):  
Elevated Temperature ◽  
Intermetallic Compound ◽  
Tial Alloy ◽  
Fatigue Property ◽  
Compound Tial

Atomic structure of interface of intermetallic compound TiAl and nitride Ti2AIN using HREM and image processing

1991 ◽  
Vol 49 ◽  
pp. 570-571
Author(s):  
E. Sukedai ◽  
H. Mabuchi ◽  
H. Hashimoto ◽  
Y. Nakayama
Keyword(s):  
Mechanical Properties ◽  
Image Processing ◽  
Composite Material ◽  
Intermetallic Compound ◽  
Side Surface ◽  
High Resolution Electron Microscopy ◽  
Hexagonal Structure ◽  
Second Phase ◽  
Resolution Electron ◽  
Compound Tial

In order to improve the mechanical properties of an intermetal1ic compound TiAl, a composite material of TiAl involving a second phase Ti2AIN was prepared by a new combustion reaction method. It is found that Ti2AIN (hexagonal structure) is a rod shape as shown in Fig.1 and its side surface is almost parallel to the basal plane, and this composite material has distinguished strength at elevated temperature and considerable toughness at room temperature comparing with TiAl single phase material. Since the property of the interface of composite materials has strong influences to their mechanical properties, the structure of the interface of intermetallic compound and nitride on the areas corresponding to 2, 3 and 4 as shown in Fig.1 was investigated using high resolution electron microscopy and image processing.

Characteristics of the nitrogen ion implanted intermetallic compound TiAl

1993 ◽  
Vol 80-81 ◽  
pp. 250-253 ◽  
Author(s):  
Wang Xi ◽  
Yang Yunjie ◽  
Liu Xianghuai ◽  
Zou Shichang ◽  
Shigeji Tanaguchi ◽  
...  
Keyword(s):  
Intermetallic Compound ◽  
Nitrogen Ion ◽  
Compound Tial ◽  
Ion Implanted

Effect of grain size and temperature on the yield stress of the intermetallic compound TiAl

1989 ◽  
Vol 23 (4) ◽  
pp. 467-469 ◽  
Author(s):  
V.K. Vasudevan ◽  
S.A. Court ◽  
P. Kurath ◽  
H.L. Fraser
Keyword(s):  
Grain Size ◽  
Intermetallic Compound ◽  
Yield Stress ◽  
Compound Tial
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