Strength Evaluation of Alumina's Spray Coating : 3rd Report, Proposal for the Safety Design of Fracture Strength with Consideration of Cracks Interference(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

Tooru ARAMAKI; Shigeru HAMADA; Hiroshi NOGUCHI; Shinya MIYAJI; Toshihiro TACHIKAWA; Arata TATSUMI; Takashi KAYAMOTO

doi:10.1299/kikaia.75.855

Strength Evaluation of Alumina's Spray Coating : 3rd Report, Proposal for the Safety Design of Fracture Strength with Consideration of Cracks Interference(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.855 ◽

2009 ◽

Vol 75 (755) ◽

pp. 855-865

Author(s):

Tooru ARAMAKI ◽

Shigeru HAMADA ◽

Hiroshi NOGUCHI ◽

Shinya MIYAJI ◽

Toshihiro TACHIKAWA ◽

...

Keyword(s):

Fracture Strength ◽

Mechanical Engineering ◽

Electronic Device ◽

Spray Coating ◽

Mechanical Reliability ◽

Special Issue ◽

Strength Evaluation ◽

Safety Design

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Strength Evaluation of Alumina's Spray Coating : 2nd Report, Proposal for Judgments of Crack Interference and Correction Methods of Crack Shape(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.845 ◽

2009 ◽

Vol 75 (755) ◽

pp. 845-854

Author(s):

Tooru ARAMAKI ◽

Shigeru HAMADA ◽

Hiroshi NOGUCHI ◽

Shinya MIYAJI ◽

Toshihiro TACHIKAWA ◽

...

Keyword(s):

Mechanical Engineering ◽

Electronic Device ◽

Spray Coating ◽

Mechanical Reliability ◽

Special Issue ◽

Strength Evaluation ◽

Crack Shape

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Atomistic Simulation of Environment-Assisted Crack Propagation Behavior of SiO_2(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.866 ◽

2009 ◽

Vol 75 (755) ◽

pp. 866-872

Author(s):

Akio YASUKAWA

Keyword(s):

Crack Propagation ◽

Atomistic Simulation ◽

Mechanical Engineering ◽

Electronic Device ◽

Mechanical Reliability ◽

Special Issue ◽

Propagation Behavior ◽

Crack Propagation Behavior

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Fatigue Life Scatter of Lead-Free Solder Joints for Chip Components(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.815 ◽

2009 ◽

Vol 75 (755) ◽

pp. 815-822

Author(s):

Hiroki MIYAUCHI ◽

Qiang YU ◽

Tadahiro SHIBUTANI

Keyword(s):

Fatigue Life ◽

Mechanical Engineering ◽

Solder Joints ◽

Electronic Device ◽

Lead Free ◽

Lead Free Solder ◽

Mechanical Reliability ◽

Special Issue ◽

Free Solder

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Nondestructive Evaluation of Thermal Fatigue Lifetime in Flip Chip Solder Joints by Synchrotron Radiation X-Ray Microtomography(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.799 ◽

2009 ◽

Vol 75 (755) ◽

pp. 799-806

Author(s):

Hiroyuki TSURITANI ◽

Toshihiko SAYAMA ◽

Yoshiyuki OKAMOTO ◽

Takeshi TAKAYANAGI ◽

Kentaro UESUGI ◽

...

Keyword(s):

Synchrotron Radiation ◽

Nondestructive Evaluation ◽

Thermal Fatigue ◽

Mechanical Engineering ◽

Flip Chip ◽

Electronic Device ◽

Mechanical Reliability ◽

Special Issue ◽

Fatigue Lifetime ◽

X Ray

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Fracture Nano-Mechanics : 1st Report, Interface Strength of Nano-Components(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.778 ◽

2009 ◽

Vol 75 (755) ◽

pp. 778-783

Author(s):

Takayuki KITAMURA ◽

Takashi SUMIGAWA ◽

Takahiro SHIMADA

Keyword(s):

Mechanical Engineering ◽

Electronic Device ◽

Interface Strength ◽

Mechanical Reliability ◽

Special Issue

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Application of Spreadsheet of Excel to Thermal Analysis on Electronic Equipment : An Example of Visualized Thermal Network Method Applied to Housing Heated by Solar Radiation(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.792 ◽

2009 ◽

Vol 75 (755) ◽

pp. 792-798

Author(s):

Toshio TOMIMURA ◽

Masaru ISHIZUKA

Keyword(s):

Thermal Analysis ◽

Solar Radiation ◽

Mechanical Engineering ◽

Electronic Device ◽

Electronic Equipment ◽

Mechanical Reliability ◽

Special Issue ◽

Thermal Network ◽

Network Method ◽

Thermal Network Method

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Evaluation of Interfacial Strength with Micro-Scale Interfacial Layer Between Resin and Silicon(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.839 ◽

2009 ◽

Vol 75 (755) ◽

pp. 839-844 ◽

Cited By ~ 1

Author(s):

Tsubasa MATSUMOTO ◽

Tomio MATSUZAKI ◽

Tadahiro SHIBUTANI ◽

Qiang YU

Keyword(s):

Interfacial Layer ◽

Mechanical Engineering ◽

Electronic Device ◽

Interfacial Strength ◽

Mechanical Reliability ◽

Special Issue ◽

Micro Scale

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Fracture Nano-Mechanics : 2nd Report, Strength of Nano-Elements(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.784 ◽

2009 ◽

Vol 75 (755) ◽

pp. 784-791

Author(s):

Takayuki KITAMURA ◽

Takashi SUMIGAWA ◽

Takahiro SHIMADA

Keyword(s):

Mechanical Engineering ◽

Electronic Device ◽

Mechanical Reliability ◽

Special Issue

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Measurement of Local Residual Stress in Si Chips Mounted by Flip Chip Technology Using Micron Scale Strain Sensors(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.831 ◽

2009 ◽

Vol 75 (755) ◽

pp. 831-838 ◽

Cited By ~ 1

Author(s):

Takuya SASAKI ◽

Nobuki UETA ◽

Hideo MIURA

Keyword(s):

Residual Stress ◽

Mechanical Engineering ◽

Flip Chip ◽

Electronic Device ◽

Strain Sensors ◽

Mechanical Reliability ◽

Special Issue ◽

Chip Technology

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The Effects of Electronic Enclosure Inlet on P-Q Curves of Installed Axial Cooling Fans(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.873 ◽

2009 ◽

Vol 75 (755) ◽

pp. 873-880 ◽

Cited By ~ 1

Author(s):

Takashi FUKUE ◽

Katsuhiro KOIZUMI ◽

Masaru ISHIZUKA ◽

Shinji NAKAGAWA

Keyword(s):

Mechanical Engineering ◽

Electronic Device ◽

Mechanical Reliability ◽

Special Issue ◽

Cooling Fans

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