Atomistic Simulation of Environment-Assisted Crack Propagation Behavior of SiO_2(<Special Issue>Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

Akio YASUKAWA

doi:10.1299/kikaia.75.866

Atomistic Simulation of Environment-Assisted Crack Propagation Behavior of SiO_2(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.866 ◽

2009 ◽

Vol 75 (755) ◽

pp. 866-872

Author(s):

Akio YASUKAWA

Keyword(s):

Crack Propagation ◽

Atomistic Simulation ◽

Mechanical Engineering ◽

Electronic Device ◽

Mechanical Reliability ◽

Special Issue ◽

Propagation Behavior ◽

Crack Propagation Behavior

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Minor Special Issue on Corrosion. Crack Propagation Behavior of Sintered Silicon Nitride under Cyclic Load at Elevated Temperature. Influences of Frequency and Stress Wave Form.

Journal of the Society of Materials Science Japan ◽

10.2472/jsms.42.976 ◽

1993 ◽

Vol 42 (479) ◽

pp. 976-982 ◽

Cited By ~ 4

Author(s):

Akira UENO ◽

Hidehiro KISHIMOTO ◽

Hiroshi KAWAMOTO ◽

Tetsuya MURASAWA

Keyword(s):

Elevated Temperature ◽

Silicon Nitride ◽

Crack Propagation ◽

Stress Wave ◽

Cyclic Load ◽

Wave Form ◽

Special Issue ◽

Propagation Behavior ◽

Crack Propagation Behavior ◽

Sintered Silicon

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Fatigue Life Scatter of Lead-Free Solder Joints for Chip Components(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.815 ◽

2009 ◽

Vol 75 (755) ◽

pp. 815-822

Author(s):

Hiroki MIYAUCHI ◽

Qiang YU ◽

Tadahiro SHIBUTANI

Keyword(s):

Fatigue Life ◽

Mechanical Engineering ◽

Solder Joints ◽

Electronic Device ◽

Lead Free ◽

Lead Free Solder ◽

Mechanical Reliability ◽

Special Issue ◽

Free Solder

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Strength Evaluation of Alumina's Spray Coating : 2nd Report, Proposal for Judgments of Crack Interference and Correction Methods of Crack Shape(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.845 ◽

2009 ◽

Vol 75 (755) ◽

pp. 845-854

Author(s):

Tooru ARAMAKI ◽

Shigeru HAMADA ◽

Hiroshi NOGUCHI ◽

Shinya MIYAJI ◽

Toshihiro TACHIKAWA ◽

...

Keyword(s):

Mechanical Engineering ◽

Electronic Device ◽

Spray Coating ◽

Mechanical Reliability ◽

Special Issue ◽

Strength Evaluation ◽

Crack Shape

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Nondestructive Evaluation of Thermal Fatigue Lifetime in Flip Chip Solder Joints by Synchrotron Radiation X-Ray Microtomography(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.799 ◽

2009 ◽

Vol 75 (755) ◽

pp. 799-806

Author(s):

Hiroyuki TSURITANI ◽

Toshihiko SAYAMA ◽

Yoshiyuki OKAMOTO ◽

Takeshi TAKAYANAGI ◽

Kentaro UESUGI ◽

...

Keyword(s):

Synchrotron Radiation ◽

Nondestructive Evaluation ◽

Thermal Fatigue ◽

Mechanical Engineering ◽

Flip Chip ◽

Electronic Device ◽

Mechanical Reliability ◽

Special Issue ◽

Fatigue Lifetime ◽

X Ray

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Fracture Nano-Mechanics : 1st Report, Interface Strength of Nano-Components(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.778 ◽

2009 ◽

Vol 75 (755) ◽

pp. 778-783

Author(s):

Takayuki KITAMURA ◽

Takashi SUMIGAWA ◽

Takahiro SHIMADA

Keyword(s):

Mechanical Engineering ◽

Electronic Device ◽

Interface Strength ◽

Mechanical Reliability ◽

Special Issue

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Application of Spreadsheet of Excel to Thermal Analysis on Electronic Equipment : An Example of Visualized Thermal Network Method Applied to Housing Heated by Solar Radiation(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.792 ◽

2009 ◽

Vol 75 (755) ◽

pp. 792-798

Author(s):

Toshio TOMIMURA ◽

Masaru ISHIZUKA

Keyword(s):

Thermal Analysis ◽

Solar Radiation ◽

Mechanical Engineering ◽

Electronic Device ◽

Electronic Equipment ◽

Mechanical Reliability ◽

Special Issue ◽

Thermal Network ◽

Network Method ◽

Thermal Network Method

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Strength Evaluation of Alumina's Spray Coating : 3rd Report, Proposal for the Safety Design of Fracture Strength with Consideration of Cracks Interference(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.855 ◽

2009 ◽

Vol 75 (755) ◽

pp. 855-865

Author(s):

Tooru ARAMAKI ◽

Shigeru HAMADA ◽

Hiroshi NOGUCHI ◽

Shinya MIYAJI ◽

Toshihiro TACHIKAWA ◽

...

Keyword(s):

Fracture Strength ◽

Mechanical Engineering ◽

Electronic Device ◽

Spray Coating ◽

Mechanical Reliability ◽

Special Issue ◽

Strength Evaluation ◽

Safety Design

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Evaluation of Interfacial Strength with Micro-Scale Interfacial Layer Between Resin and Silicon(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.839 ◽

2009 ◽

Vol 75 (755) ◽

pp. 839-844 ◽

Cited By ~ 1

Author(s):

Tsubasa MATSUMOTO ◽

Tomio MATSUZAKI ◽

Tadahiro SHIBUTANI ◽

Qiang YU

Keyword(s):

Interfacial Layer ◽

Mechanical Engineering ◽

Electronic Device ◽

Interfacial Strength ◽

Mechanical Reliability ◽

Special Issue ◽

Micro Scale

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Fracture Nano-Mechanics : 2nd Report, Strength of Nano-Elements(Thermal and Mechanical Reliability of Electronic Device and Mechanical Engineering)

TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A ◽

10.1299/kikaia.75.784 ◽

2009 ◽

Vol 75 (755) ◽

pp. 784-791

Author(s):

Takayuki KITAMURA ◽

Takashi SUMIGAWA ◽

Takahiro SHIMADA

Keyword(s):

Mechanical Engineering ◽

Electronic Device ◽

Mechanical Reliability ◽

Special Issue

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312 Atomistic Simulation of Crack Propagation Behavior of SiO_2

The Proceedings of Ibaraki District Conference ◽

10.1299/jsmeibaraki.2009.89 ◽

2009 ◽

Vol 2009 (0) ◽

pp. 89-90

Author(s):

Akio YASUKAWA

Keyword(s):

Crack Propagation ◽

Atomistic Simulation ◽

Propagation Behavior ◽

Crack Propagation Behavior

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