scholarly journals Effects of temperature conditions on fracture toughness of single crystal silicon wafer

2019 ◽  
Vol 6 (4) ◽  
pp. 19-00062-19-00062
Author(s):  
Yudai SHIROKI ◽  
Kazuki IIDA ◽  
Satoshi SUTO ◽  
Masayoshi TATENO
2011 ◽  
Vol 2011.17 (0) ◽  
pp. 29-30
Author(s):  
Satoshi SUTO ◽  
Masayoshi MIYASAKA ◽  
Junichi SHIBUGUCHI ◽  
Masayoshi TATENO

2012 ◽  
Vol 430-432 ◽  
pp. 404-407
Author(s):  
J.J. Li ◽  
C.W. Zhao ◽  
Y.M. Xing ◽  
Z.Y. Lv ◽  
Y.G. Du

The failure components made of silicon is an important issue in the electronic and nano-technological developments. A study on the near-crack-tip deformation of single-crystal silicon wafer under tensile load was presented. The strain formulas around the crack tip of mode I crack were deduced from linear elastic fracture mechanics. The strain fields around the crack tip were simulated and analyzed in detail.


2002 ◽  
Vol 43 (3) ◽  
pp. 566-570 ◽  
Author(s):  
Tingbin Wu ◽  
Bohong Jiang ◽  
Xuan Qi ◽  
Yushu Liu ◽  
Dong Xu ◽  
...  

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