Simulation of near-Crack-Tip Strain Fields on Single-Crystal Silicon Wafer
2012 ◽
Vol 430-432
◽
pp. 404-407
Keyword(s):
The failure components made of silicon is an important issue in the electronic and nano-technological developments. A study on the near-crack-tip deformation of single-crystal silicon wafer under tensile load was presented. The strain formulas around the crack tip of mode I crack were deduced from linear elastic fracture mechanics. The strain fields around the crack tip were simulated and analyzed in detail.
2019 ◽
Vol 30
(1)
◽
pp. 015003
2016 ◽
Vol 32
(1)
◽
pp. 283-289
◽
2011 ◽
Vol 2011.17
(0)
◽
pp. 29-30
2011 ◽
Vol 2011
(0)
◽
pp. 122-123
Keyword(s):
2012 ◽
Vol 2012
(0)
◽
pp. 126-127
2008 ◽
Vol 53-54
◽
pp. 167-172
◽