Microgratings for high-efficiency guided-beam deflection fabricated by electron-beam direct-writing techniques

1980 ◽  
Vol 19 (16) ◽  
pp. 2842 ◽  
Author(s):  
Y. Handa ◽  
T. Suhara ◽  
H. Nishihara ◽  
J. Koyama
Author(s):  
Michael F. Zaeh ◽  
Stefan Lutzmann ◽  
Gregor Branner ◽  
Gerhard Strasser

Additive Layer manufacturing methods constitute an interesting alternative with respect to the production of small series and customized products. Among other advantages, these methods offer an extensive flexibility concerning end customer parts (Rapid Manufacturing) or tools for prototypes and small batches (Rapid Tooling). Up to recent years, machines using laser beams for the solidification of powder material, e.g. Selective Laser Melting, were available on the world market. However, the extensive use of the electron beam in manufacturing processes like welding or perforating revealed its considerable potentials. These are, among others, fast beam deflection, high beam power density as well as high efficiency. Therefore, commercial organizations and research institutions like the iwb make use of this energy source in additive layer manufacturing. The resulting technology Electron Beam Sintering (EBS) is characterized by a complex interaction of various process parameters. In this paper, methods of numerical simulation are used in order to model the process sequence of solidification and to define the governing factors. The heat transfer into the powder bed has been identified as a vital aspect concerning the process stability and the resulting part quality. Therefore, the interaction between beam and powder material is being examined in detail. First, the process is subdivided into discretized solidification steps which enable the definition of a certain system boundary. Second, the determining differential equations are being formed and, due to various boundary conditions, solved using a commercially available software package, implying the Finite Element Method (FEM). Third, the necessary energy input into the powder can be determined and finally, experimental series are being conducted in order to validate the numerical results and identify optimum process parameters.


2011 ◽  
Vol 2011 (1) ◽  
pp. 000600-000607 ◽  
Author(s):  
T. Burkhardt ◽  
M. Mohaupt ◽  
M. Hornaff ◽  
B. Zaage ◽  
E. Beckert ◽  
...  

Multi-Shaped electron beam lithography is considered a promising approach for high throughput mask and direct writing. Providing multiple apertures and individually controlled electrodes it allows for massive parallelization of exposure shots, thus significantly decreasing write time. A silicon-based micro-structured MEMS multi-beam deflection array (MDA) featuring 8×8 apertures is presented. The hybrid integration of MDA devices in ceramic system carriers utilizing a laser-based Solderjet Bumping process is demonstrated. This flux-free soldering process provides adhesive-free, long term stable and vacuum compatible joints and is used for both mechanical fixation and electrical connection. Electron beam deflection in two perpendicular directions requires the highly accurate placement of two crossed MDA devices, which is carried out by three degrees of freedom alignment procedures and solder joining. Electrical signal routing within the electron optical column using flexible printed circuit boards and flux-free soldering is also reported. The precision adjustment of two carriers is accomplished by fiducial mark detection using image processing. Results on alignment accuracy in the sub-micron range, mechanical and electrical testing of such assemblies are reported.


1981 ◽  
Vol 64 (2) ◽  
pp. 101-107
Author(s):  
Yoshifusa Wada ◽  
Masatoshi Migitaka ◽  
Yasuhide Hisamoto ◽  
Koichiro Mizukami

2015 ◽  
Vol 21 (6) ◽  
pp. 1639-1643 ◽  
Author(s):  
Shih-En Lai ◽  
Ying-Jhan Hong ◽  
Yu-Ting Chen ◽  
Yu-Ting Kang ◽  
Pin Chang ◽  
...  

AbstractWe demonstrate direct electron beam writing of a nano-scale Cu pattern on a surface with a thin aqueous layer of CuSO4 solution. Electron beams are highly maneuverable down to nano-scales. Aqueous solutions facilitate a plentiful metal ion supply for practical industrial applications, which may require continued reliable writing of sophisticated patterns. A thin aqueous layer on a surface helps to confine the writing on the surface. For this demonstration, liquid sample holder (K-kit) for transmission electron microscope (TEM) was employed to form a sealed space in a TEM. The aqueous CuSO4 solution inside the sample holder was allowed to partially dry until a uniform thin layer was left on the surface. The electron beam thus reduced Cu ions in the solution to form the desired patterns. Furthermore, the influence of e-beam exposure time and CuSO4(aq) concentration on the Cu reduction was studied in this work. Two growth stages of Cu were shown in the plot of Cu thickness versus e-beam exposure time. The measured Cu reduction rate was found to be proportional to the CuSO4(aq) concentration.


2015 ◽  
Vol 26 (47) ◽  
pp. 475701 ◽  
Author(s):  
F Porrati ◽  
M Pohlit ◽  
J Müller ◽  
S Barth ◽  
F Biegger ◽  
...  

1995 ◽  
Vol 78 (8) ◽  
pp. 81-91 ◽  
Author(s):  
Hidenori Yamaguchi ◽  
Toshio Sakamizu ◽  
Fumio Murai ◽  
Hiroshi Shiraishi ◽  
Hajime Hayakawa ◽  
...  

2018 ◽  
Vol 11 (9) ◽  
pp. 091003 ◽  
Author(s):  
Valentin N. Jmerik ◽  
Dmitrii V. Nechaev ◽  
Alexey A. Toropov ◽  
Evgenii A. Evropeitsev ◽  
Vladimir I. Kozlovsky ◽  
...  

Author(s):  
Н.С. Гинзбург ◽  
Е.Р. Кочаровская ◽  
М.Н. Вилков ◽  
А.С. Сергеев

AbstractIt is used that there is great potential in the use of multichannel laser complexes for incoherent pumping of X-ray Compton free-electron lasers based on stimulated wave backscattering on high-current moderately relativistic electron beam. The relative width of the pump spectrum must be comparable with that of the energy spectrum of the electron beam, which ensures involvement of a significant fraction of particles into the scattering process and, hence, high efficiency of their kinetic energy conversion into X-ray radiation.


1993 ◽  
Vol 63 (5) ◽  
pp. 645-647 ◽  
Author(s):  
G. Y. Chang ◽  
R. B. Givens ◽  
J. W. M. Spicer ◽  
R. Osiander ◽  
J. C. Murphy

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