Nano-finishing of the monocrystalline silicon wafer using magnetic abrasive finishing process

2019 ◽  
Vol 58 (13) ◽  
pp. 3447 ◽  
Author(s):  
Mohammad Mosavat ◽  
Abdolreza Rahimi ◽  
Mohammad Javad Eshraghi ◽  
Saeideh Karami
Keyword(s):  
Silicon Wafer ◽  
Monocrystalline Silicon ◽  
Magnetic Abrasive Finishing ◽  
Finishing Process ◽  
Abrasive Finishing

Improve the Micro-hardness of Single Point Incremental Forming Product Using Magnetic Abrasive Finishing

2020 ◽  
Vol 38 (8A) ◽  
pp. 1137-1142
Author(s):  
Baqer A. Ahmed ◽  
Saad K. Shather ◽  
Wisam K. Hamdan
Keyword(s):  
Vickers Hardness ◽  
Feed Rate ◽  
Incremental Forming ◽  
Single Point ◽  
Single Point Incremental Forming ◽  
Step Size ◽  
Coil Current ◽  
Magnetic Abrasive Finishing ◽  
Finishing Process ◽  
Abrasive Finishing

In this paper the Magnetic Abrasive Finishing (MAF) was utilized after Single Point Incremental Forming (SPIF) process as a combined finishing process. Firstly, the Single Point Incremental forming was form the truncated cone made from low carbon steel (1008-AISI) based on Z-level tool path then the magnetic abrasive finishing process was applied on the surface of the formed product. Box-Behnken design of experiment in Minitab 17 software was used in this study. The influences of different parameters (feed rate, machining step size, coil current and spindle speed) on change in Micro-Vickers hardness were studied. The maximum and minimum change in Micro-Vickers hardness that achieved from all the experiments were (40.4 and 1.1) respectively. The contribution percent of (feed rate, machining step size, coil current and spindle speed) were (7.1, 18.068, 17.376 and 37.894) % respectively. After MAF process all the micro surface cracks that generated on the workpiece surface was completely removed from the surface.

scholarly journals Development of a New Finishing Process Combining a Fixed Abrasive Polishing with Magnetic Abrasive Finishing Process

Machines ◽  
2021 ◽  
Vol 9 (4) ◽  
pp. 81
Author(s):  
Yanhua Zou ◽  
Ryunosuke Satou ◽  
Ozora Yamazaki ◽  
Huijun Xie
Keyword(s):  
Alumina Ceramic ◽  
Ceramic Plate ◽  
Polishing Process ◽  
High Quality ◽  
Influence Of Process Parameters ◽  
Magnetic Abrasive Finishing ◽  
Nano Scale ◽  
Finishing Process ◽  
Abrasive Finishing ◽  
Fixed Abrasive

High quality, highly efficient finishing processes are required for finishing difficult-to-machine materials. Magnetic abrasive finishing (MAF) process is a finishing method that can obtain a high accuracy surface using fine magnetic particles and abrasive particles, but has poor finishing efficiency. On the contrary, fixed abrasive polishing (FAP) is a polishing process can obtain high material removal efficiency but often cannot provide a high-quality surface at the nano-scale. Therefore, this work proposes a new finishing process, which combines the magnetic abrasive finishing process and the fixed abrasive polishing process (MAF-FAP). To verify the proposed methodology, a finishing device was developed and finishing experiments on alumina ceramic plates were performed. Furthermore, the mechanism of the MAF-FAP process was investigated. In addition, the influence of process parameters on finishing characteristics is discussed. According to the experimental results, this process can achieve high-efficiency finishing of brittle hard materials (alumina ceramics) and can obtain nano-scale surfaces. The surface roughness of the alumina ceramic plate is improved from 202.11 nm Ra to 3.67 nm Ra within 30 min.

Experimental investigation into polishing of monocrystalline silicon wafer using double-disc chemical assisted magnetorheological finishing process

2021 ◽  
pp. 095440622098384
Author(s):  
Mayank Srivastava ◽  
Pulak M Pandey
Keyword(s):  
Surface Roughness ◽  
Silicon Wafer ◽  
Flow Rate ◽  
Silicon Wafers ◽  
Monocrystalline Silicon ◽  
Slurry Flow ◽  
Magnetorheological Finishing ◽  
Finishing Process ◽  
Process Factors ◽  
Slurry Flow Rate

In the present work, a novel hybrid finishing process that combines the two preferred methods in industries, namely, chemical-mechanical polishing (CMP) and magneto-rheological finishing (MRF), has been used to polish monocrystalline silicon wafers. The experiments were carried out on an indigenously developed double-disc chemical assisted magnetorheological finishing (DDCAMRF) experimental setup. The central composite design (CCD) was used to plan the experiments in order to estimate the effect of various process factors, namely polishing speed, slurry flow rate, percentage CIP concentration, and working gap on the surface roughness ([Formula: see text]) by DDCAMRF process. The analysis of variance was carried out to determine and analyze the contribution of significant factors affecting the surface roughness of polished silicon wafer. The statistical investigation revealed that percentage CIP concentration with a contribution of 30.6% has the maximum influence on the process performance followed by working gap (21.4%), slurry flow rate (14.4%), and polishing speed (1.65%). The surface roughness of polished silicon wafers was measured by the 3 D optical profilometer. Scanning electron microscopy (SEM) and atomic force microscopy (AFM) were carried out to understand the surface morphology of polished silicon wafer. It was found that the surface roughness of silicon wafer improved with the increase in polishing speed and slurry flow rate, whereas it was deteriorated with the increase in percentage CIP concentration and working gap.

Sign in / Sign up

Export Citation Format

Share Document