To study the bending characteristics of copper alloy thin plate by single pulse laser, the thermal mechanical coupling model of pulsed laser forming (PLF) was established; the dynamic change and steady distribution for the fields of temperature, stress& strain and displacement were analyzed. The results show n that during the pulse laser heating stage, the temperature gradient along the thickness direction is far less than that of the heat affected zone; due to the constraints of materials around the heating field, the compressive stress and negative strain are appeared, the cantilever end of sample produces warping deformations; in the cooling stage, the temperature of top and bottom surface material drops rapidly, the sample is with a negative bending and reduced deformation. This is related to the transferring of the stress change and the recovery of part of the elastic deformation in heating area.
Optical dipole force on ladderlike three-level atomic systems induced by few-cycle-pulse laser fields
