This paper focuses on the non-destructive dielectric measurement for low-loss planar materials with a thickness of less than 3 mm using a large coaxial probe with an outer diameter of 48 mm. The aperture probe calibration procedure required only to make a measurement of the half-space air and three offset shorts. The reflection coefficient for the thin material is measured using a Keysight E5071C network analyzer from 0.3 MHz to 650 MHz and then converted to a relative dielectric constant, εr and tangent loss, tan δ via closed form capacitance model and lift-off calibration process. Average measurement error of dielectric constant, Δεr is less than 6% from 1 MHz to 400 MHz and the resolution of loss tangent, tan δ measurement is capable of achieving 10−3.
Si-CMOS-compatible lift-off fabrication of low-loss planar chalcogenide waveguides