SPALL REPAIR USING A 3D PRINTER AND EPOXY RESIN ADHESIVE

2017 ◽  
Vol 4 (1) ◽  
Author(s):  
Jaeheum Yeon ◽  
Julian Kang
Keyword(s):  
Shear Strength ◽  
Epoxy Resin ◽  
Adhesive Layer ◽  
Bond Line ◽  
Test Method ◽  
Strength Development ◽  
Resin Adhesive ◽  
Line Thickness ◽  
Bond Line Thickness ◽  
Epoxy Resin Adhesive

The spall repair sequence currently used is as follows. The damage is removed from the area with heavy equipment and fresh concrete is poured into the cleaned section. A curing compound is then applied to the patch to prevent drying shrinkage or to absorb water. But this spall repair method requires a great deal of equipment and time. During the repair process, adjacent roads must be closed in order to secure a working space, often resulting in traffic congestion. According to a report by the US Department of Transportation, the depreciation can be up to $20,000 a day due to traffic jams. The depreciation can easily reach up to $140,000 when a road is blocked for seven days to repair a spall. The objective of this research is to see if 3D printing technology can be used to repair spall damage on a concrete pavement. More specifically, this study, using a simple finite element method, investigates whether the bond line thickness will have an influence on shear strength development when an adhesive layer is present between the spall and the 3D printed concrete segment. In addition, this study proposes a modified test method of ASTM C882 to experimentally investigate the influence of bond line thickness of epoxy-resin adhesive on shear strength when the glue applied to a concrete adherend.

scholarly journals Effect of Post-cure on Bond Strength Development of Epoxy Resin Adhesive in Wood Bonding

2009 ◽  
Vol 45 (8) ◽  
pp. 298-303
Author(s):  
Atsuko SANO ◽  
Mayu SHINODA ◽  
Masaaki YAMADA ◽  
Kinji TAKI ◽  
Hiroaki YOSHIDA
Keyword(s):  
Bond Strength ◽  
Epoxy Resin ◽  
Strength Development ◽  
Resin Adhesive ◽  
Wood Bonding ◽  
Epoxy Resin Adhesive

scholarly journals Effect of Nonwoven Carbon Tissue-Reinforced Epoxy Resin Adhesive Layer on the Single Lap Bonding Strength of Aluminum Alloy Joints

ACS Omega ◽  
2021 ◽  
Vol 6 (37) ◽  
pp. 23802-23813
Author(s):  
Zhifeng Hu ◽  
Haijuan Kong ◽  
Lei Tao ◽  
Mengmeng Qiao ◽  
Dongzi Yu ◽  
...  
Keyword(s):  
Aluminum Alloy ◽  
Epoxy Resin ◽  
Bonding Strength ◽  
Adhesive Layer ◽  
Resin Adhesive ◽  
Epoxy Resin Adhesive

scholarly journals Effect of Bond-Line Thickness on Fatigue Crack Growth of Structural Acrylic Adhesive Joints

Materials ◽  
2021 ◽  
Vol 14 (7) ◽  
pp. 1723
Author(s):  
Yu Sekiguchi ◽  
Chiaki Sato
Keyword(s):  
Fatigue Crack ◽  
Fatigue Crack Growth ◽  
Crack Growth ◽  
Fatigue Behavior ◽  
Adhesive Bond ◽  
Bond Line ◽  
Loading Conditions ◽  
Fatigue Crack Growth Resistance ◽  
Line Thickness ◽  
Bond Line Thickness

With an increasing demand for adhesives, the durability of joints has become highly important. The fatigue resistance of adhesives has been investigated mainly for epoxies, but in recent years many other resins have been adopted for structural adhesives. Therefore, understanding the fatigue characteristics of these resins is also important. In this study, the cyclic fatigue behavior of a two-part acrylic-based adhesive used for structural bonding was investigated using a fracture-mechanics approach. Fatigue tests for mode I loading were conducted under displacement control using double cantilever beam specimens with varying bond-line thicknesses. When the fatigue crack growth rate per cycle, da/dN, reached 10−5 mm/cycle, the fatigue toughness reduced to 1/10 of the critical fracture energy. In addition, significant changes in the characteristics of fatigue crack growth were observed varying the bond-line thickness and loading conditions. However, the predominance of the adhesive thickness on the fatigue crack growth resistance was confirmed regardless of the initial loading conditions. The thicker the adhesive bond line, the greater the fatigue toughness.

Analysis of the physcial properties of particleboard from a mixture of cocoa pod peel powder and styrofoam

2021 ◽  
Vol 5 (1) ◽  
pp. 7
Author(s):  
Ety Jumiati ◽  
Endang Sagita Ritonga ◽  
Abdul Halim Daulay
Keyword(s):  
Moisture Content ◽  
Physical Properties ◽  
Epoxy Resin ◽  
Powder Mixture ◽  
Surface Shape ◽  
Particle Board ◽  
Hot Press ◽  
Resin Adhesive ◽  
Cocoa Pod Husk ◽  
Epoxy Resin Adhesive

<p><strong><em>Abstract</em></strong><strong></strong></p><p><strong><em>Abstract. This study aims to determine the effect of optimal physical properties and microstructure on particleboard samples. The percentage variations of cocoa pod peel powder mixture, styrofoam with epoxy resin adhesive were sample A (69:0:30), sample B (68:2:30), sample C (67:3:30), and sample D (66:4:30). 6:30). The materials were compressed were a hot press and a conditioning time of 14 days. sThe most optimum particleboard sample was found in sample B with values of density, moisture content, and thickness expansion, respectively 0,80 g/cm</em></strong><strong><em><sup>2</sup></em></strong><strong><em>, 7,74%, and 9,32%, and met the standards of SNI 03-2105- 2006. The surface shape of the particle board morphology in sample B shows the composition of the material with the adhesive binding optimally so that there are very few empty spaces or cavities.</em></strong><strong></strong></p><h1 align="center"><em> </em></h1><p><strong><em>Keywords:</em></strong><em> cocoa pod husk powder, styrofoam, particle board, epoxy resin.</em></p>

Die Attach Process Analysis of Enhanced Stand-off Stopper on Tapeless Leadframe

2020 ◽  
pp. 22-26
Author(s):  
E. Graycochea Jr. ◽  
F. Gomez ◽  
R. Rodriguez ◽  
B. Bacquian
Keyword(s):  
Process Analysis ◽  
Semiconductor Industry ◽  
Bond Line ◽  
Line Thickness ◽  
Design Structure ◽  
Die Attach ◽  
Bond Line Thickness ◽  
Improved Design

Improvement on the process and design is often a reliable way to resolve a problem especially in semiconductor industry. This paper presents a leadframe or semiconductor carrier merged with a stand-off design structure that will maintain a consistent bond line thickness (BLT) criteria for quad-flat no-leads (QFN) packages. Through package and process conceptualization, the stand-off design located on the leadframe underneath the silicon die corners would result to a steady and consistent BLT during die attach process. With the improved design, die tilt occurrence in die attach process would be mitigated.

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