Characteristics of ductile mode chip formation in nanoscale cutting of brittle materials

2007 ◽  
Vol 1 (1) ◽  
pp. 37 ◽  
Author(s):  
Xiaoping Li ◽  
Minbo Cai ◽  
Kui Liu ◽  
Mustafizur Rahman
Keyword(s):  
Chip Formation ◽  
Brittle Materials ◽  
Ductile Mode ◽  
Nanoscale Cutting

High-pressure phase transformation as the mechanism of ductile chip formation in nanoscale cutting of silicon wafer

2007 ◽  
Vol 221 (10) ◽  
pp. 1511-1519 ◽  
Author(s):  
M B Cai ◽  
X P Li ◽  
M Rahman
Keyword(s):  
Plastic Deformation ◽  
Phase Transformation ◽  
Silicon Wafer ◽  
Chip Formation ◽  
Md Simulations ◽  
Workpiece Material ◽  
Ductile Mode ◽  
Formation Zone ◽  
Ductile Mode Cutting ◽  
Nanoscale Cutting

In nanoscale cutting of silicon wafer, it has been found that under certain conditions ductile mode chip formation can be achieved. In order to understand the mechanism of the ductile chip formation, experiments and molecular dynamics (MD) simulations have been conducted in this study. The results of MD simulations of nanoscale cutting of silicon showed that because of the high hydrostatic pressure in the chip formation zone, there is a phase transformation of the monocrytslline silicon from diamond cubic structure to both β silicon and amorphous phase in the chip formation zone, which results in plastic deformation of the workpiece material in the chip formation zone, as observed in experiments. The results further showed that although from experimental observation the plastic deformation in the ductile mode cutting of silicon is similar to that in cutting of ductile materials, such as aluminium, in ductile mode cutting of silicon it is the phase transformation of silicon rather than atomic dislocation that results in the plastic deformation.

CONTROL OF GRAIN, DEPTH OF CUT IN DUCTILE MODE GRINDING OF BRITTLE MATERIALS AND PRACTICAL APPLICATION

1997 ◽  
Author(s):  
AKIRA KANAI ◽  
MASAKAZU MIYASHITA ◽  
FUMIO INABA ◽  
MASAKAZU SATO ◽  
TADASHI YOKOTSUKA ◽  
...  
Keyword(s):  
Brittle Materials ◽  
Depth Of Cut ◽  
Practical Application ◽  
Ductile Mode

scholarly journals A Review of Partial Ductile Mode Machining for Brittle Materials

2018 ◽  
Vol 455 ◽  
pp. 012057 ◽  
Author(s):  
P.P.S. Keerthi ◽  
S. Anoop Kumar ◽  
P.P.C. Prasad ◽  
K. Hemalatha
Keyword(s):  
Brittle Materials ◽  
Ductile Mode

Ultraprecision Cutting of Glass BK7

2006 ◽  
Vol 315-316 ◽  
pp. 536-540 ◽  
Author(s):  
Ming Zhou ◽  
X.D. Liu ◽  
S.N. Huang
Keyword(s):  
Tool Wear ◽  
Ultrasonic Vibration ◽  
Wear Mechanism ◽  
Optical Glass ◽  
Brittle Materials ◽  
Optical Quality ◽  
Diamond Cutting ◽  
Ductile Mode ◽  
Tool Wear Mechanism ◽  
Ductile Mode Cutting

The development of the capability to machine glass materials to optical quality is highly desirable. In this work, the deformation characteristics of brittle materials were analyzed by micro and nano indentations. Diamond cutting of optical glass BK7 was performed in order to investigate the tool wear mechanism in machining of brittle materials and the effect of tool vibration on material removal mechanism. The tool wear mechanism was discussed on the basis of the observation of wear zone. Ductile-mode cutting has easily been achieved with the application of ultrasonic vibration during cutting of glass. It was confirmed experimentally that the tool wear and surface finish were improved significantly by applying ultrasonic vibration to the cutting tool.

Research on the Ductile Chip Formation in Grinding of Brittle Materials

2011 ◽  
Vol 487 ◽  
pp. 58-62
Author(s):  
Yun Feng Peng ◽  
Zhi Qiang Liang ◽  
Yong Bo Wu ◽  
Yin Biao Guo ◽  
T. Jiang ◽  
...  
Keyword(s):  
Shear Stress ◽  
Compressive Stress ◽  
Chip Formation ◽  
Thrust Force ◽  
Brittle Materials ◽  
Chip Thickness ◽  
Force Model ◽  
Theoretical Discussion ◽  
Undeformed Chip Thickness ◽  
Formation Zone

A theoretical discussion has been presented for the ductile chip formation in grinding of brittle materials. The single abrasive grit was dealt with a top-rounded cutter removing material of varying undeformed chip thickness. The force model in the chip formation zone was established. The stress analysis showed that larger compressive stress and shear stress can be generated in the chip formation zone, which shields the growth of pre-existing flaws in the material by suppressing the stress intensity factor. When the stress intensify factor is smaller than fracture toughness and the resolved shear stress exceeds the critical flow stress of the material, the ductile chip is formed. Experiments of monocrystal silicon grinding were conducted. The results show that the thrust force is much larger than the cutting force, which ensures the larger compressive stress in the chip formation zone and the formation of ductile chip.

Sign in / Sign up

Export Citation Format

Share Document