scholarly journals Preparation of Ti/IrO2 Anode with Low Iridium Content by Thermal Decomposition Process: Electrochemical removal of organic pollutants in water

2018 ◽  
Vol 4 (1) ◽  
pp. 1-5 ◽  
Author(s):  
Asim Yaqub ◽  
Mohamed Hasnain Isa ◽  
Huma Ajab ◽  
S.R.M Kutty ◽  
Ezerie H. Ezechi ◽  
...  
Keyword(s):  
Thermal Decomposition ◽  
High Temperature ◽  
Surface Morphology ◽  
Organic Pollutants ◽  
Electrochemical Cell ◽  
Cod Removal ◽  
Titanium Plate ◽  
Thermal Decomposition Process ◽  
Coated Surface ◽  
Electrochemical Removal

Abstract In this study IrO2 (Iridium oxide) was coated onto a titanium plate anode from a dilute (50 mg/10 ml) IrCl3×H2O salt solution. Coating was done at high temperature (550∘C) using thermal decomposition. Surface morphology and characteristics of coated surface of Ti/IrO2 anode were examined by FESEM and XRD. The coated anode was applied for electrochemical removal of organic pollutants from synthetic water samples in 100 mL compartment of batch electrochemical cell. About 50% COD removal was obtained at anode prepared with low Ir content solution while 72% COD removal was obtained with anode prepared at high Ir content. Maximum COD removal was obtained at 10 mA/cm2 current density.

scholarly journals Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

RSC Advances ◽  
2017 ◽  
Vol 7 (40) ◽  
pp. 25095-25100 ◽  
Author(s):  
Kuan-Ming Huang ◽  
Hiroki Tsukamoto ◽  
Yingqiong Yong ◽  
Hsien-Lung Chiu ◽  
Mai Thanh Nguyen ◽  
...  
Keyword(s):  
Thin Films ◽  
Thermal Decomposition ◽  
Surface Morphology ◽  
Mechanical Stability ◽  
Copper Ion ◽  
Decomposition Process ◽  
Thermal Decomposition Process ◽  
Printed Patterns

An alkylamine is added to stabilize the thermal decomposition process and to improve the surface morphology of printed patterns. The adhesion and mechanical stability of the copper thin films are also investigated.

Surface morphology of ion-beam deposited carbon films under high temperature

2002 ◽  
Vol 20 (6) ◽  
pp. 2072
Author(s):  
Meiyong Liao ◽  
Chunlin Chai ◽  
Shaoyan Yang ◽  
Zhikai Liu ◽  
Fuguang Qin ◽  
...  
Keyword(s):  
High Temperature ◽  
Surface Morphology ◽  
Ion Beam ◽  
Carbon Films

scholarly journals Thermal behavior and decomposition kinetics of rifampicin polymorphs under isothermal and non-isothermal conditions

2010 ◽  
Vol 46 (2) ◽  
pp. 343-351 ◽  
Author(s):  
Ricardo Alves ◽  
Thaís Vitória da Silva Reis ◽  
Luis Carlos Cides da Silva ◽  
Silvia Storpírtis ◽  
Lucildes Pita Mercuri ◽  
...  
Keyword(s):  
Thermal Decomposition ◽  
Thermal Behavior ◽  
Melting Process ◽  
Decomposition Process ◽  
Stable Form ◽  
Thermal Decomposition Process ◽  
Mean Values ◽  
Conversion Level ◽  
Polymorphic Forms ◽  
Crystalline Forms

The thermal behavior of two polymorphic forms of rifampicin was studied by DSC and TG/DTG. The thermoanalytical results clearly showed the differences between the two crystalline forms. Polymorph I was the most thermally stable form, the DSC curve showed no fusion for this species and the thermal decomposition process occurred around 245 ºC. The DSC curve of polymorph II showed two consecutive events, an endothermic event (Tpeak = 193.9 ºC) and one exothermic event (Tpeak = 209.4 ºC), due to a melting process followed by recrystallization, which was attributed to the conversion of form II to form I. Isothermal and non-isothermal thermogravimetric methods were used to determine the kinetic parameters of the thermal decomposition process. For non-isothermal experiments, the activation energy (Ea) was derived from the plot of Log β vs 1/T, yielding values for polymorph form I and II of 154 and 123 kJ mol-1, respectively. In the isothermal experiments, the Ea was obtained from the plot of lnt vs 1/T at a constant conversion level. The mean values found for form I and form II were 137 and 144 kJ mol-1, respectively.

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