scholarly journals Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns

RSC Advances ◽  
2017 ◽  
Vol 7 (40) ◽  
pp. 25095-25100 ◽  
Author(s):  
Kuan-Ming Huang ◽  
Hiroki Tsukamoto ◽  
Yingqiong Yong ◽  
Hsien-Lung Chiu ◽  
Mai Thanh Nguyen ◽  
...  

An alkylamine is added to stabilize the thermal decomposition process and to improve the surface morphology of printed patterns. The adhesion and mechanical stability of the copper thin films are also investigated.

2010 ◽  
Vol 46 (2) ◽  
pp. 343-351 ◽  
Author(s):  
Ricardo Alves ◽  
Thaís Vitória da Silva Reis ◽  
Luis Carlos Cides da Silva ◽  
Silvia Storpírtis ◽  
Lucildes Pita Mercuri ◽  
...  

The thermal behavior of two polymorphic forms of rifampicin was studied by DSC and TG/DTG. The thermoanalytical results clearly showed the differences between the two crystalline forms. Polymorph I was the most thermally stable form, the DSC curve showed no fusion for this species and the thermal decomposition process occurred around 245 ºC. The DSC curve of polymorph II showed two consecutive events, an endothermic event (Tpeak = 193.9 ºC) and one exothermic event (Tpeak = 209.4 ºC), due to a melting process followed by recrystallization, which was attributed to the conversion of form II to form I. Isothermal and non-isothermal thermogravimetric methods were used to determine the kinetic parameters of the thermal decomposition process. For non-isothermal experiments, the activation energy (Ea) was derived from the plot of Log β vs 1/T, yielding values for polymorph form I and II of 154 and 123 kJ mol-1, respectively. In the isothermal experiments, the Ea was obtained from the plot of lnt vs 1/T at a constant conversion level. The mean values found for form I and form II were 137 and 144 kJ mol-1, respectively.


2021 ◽  
Author(s):  
Ikuo Ioka ◽  
Jin Iwatsuki ◽  
Yoshiro Kuriki ◽  
Daisuke Kawai ◽  
Hiroki Yokota ◽  
...  

2017 ◽  
Vol 31 (9) ◽  
pp. 9824-9832 ◽  
Author(s):  
Siqi Zhao ◽  
Liping Ma ◽  
Jie Yang ◽  
Dalong Zheng ◽  
Hongpan Liu ◽  
...  

2005 ◽  
Vol 79 (1) ◽  
pp. 181-186 ◽  
Author(s):  
J.-J. Zhang ◽  
R.-F. Wang ◽  
S.-P. Wang ◽  
H.-M. Liu ◽  
J.-B. Li ◽  
...  

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