Stabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patterns
Keyword(s):
An alkylamine is added to stabilize the thermal decomposition process and to improve the surface morphology of printed patterns. The adhesion and mechanical stability of the copper thin films are also investigated.
1991 ◽
Vol 190
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pp. 145-147
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1964 ◽
Vol 13
(133)
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pp. 773-777
2010 ◽
Vol 46
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pp. 343-351
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2017 ◽
Vol 129
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pp. 1875-1885
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2008 ◽
Vol 47
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pp. 1098-1100
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Vol 28
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pp. 13548-13555
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2017 ◽
Vol 31
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pp. 9824-9832
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Keyword(s):
2018 ◽
Vol 6
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pp. 015005
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2005 ◽
Vol 79
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pp. 181-186
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