Analysis of Electromigration- and Stress-Induced Dynamical Response of Voids Confined in Metallic Thin Films

A theoretical analysis based on self-consistent dynamical simulations is presented of electromigration- and stress-induced surface morphological response of voids confined in metallic thin films. The analysis predicts the onset of stable time-periodic states for the void surface morphological response, which is associated with current-driven wave propagation on the void surface. This time-periodic response is demonstrated under certain electromigration conditions and detailed response diagrams are presented which map the corresponding parameter space to regions of steady, time-periodic, and unstable surface morphological response. The evolution of the electrical resistance of these thin films also is computed, providing an interpretation for experimentally observed time-periodic response of the electrical resistance of metallic interconnect lines on the basis of current-driven void morphological evolution. In addition, we demonstrate significant effects on the electromigration-induced morphologically stable void migration of mechanical stress application in a metallic thin film. Specifically, we find that under certain electromechanical conditions, elastic stress can cause substantial retardation of void motion, as measured by the constant speed of electromigration-induced translation of morphologically stable voids. More importantly, this effect suggests the possibility for complete inhibition of void motion under stress.