Reduction in the Effective Barrier Height in Ptsi-P-Si Schottky Diodes by Using Low Energy Ion Implantation

1981 ◽  
Vol 10 ◽  
Author(s):  
C.-Y. Wei ◽  
W. Tantraporn ◽  
W. Katz ◽  
G. Smith

A reduction in the effective barrier height in a PtSi-p-Si Schottky diode was achieved using low energy ion implantation to introduce a shallow p+ layer on a p-Si substrate. After the Schottky diode had been implanted with 3 keV 11B+ ions to a dose of 4 × 1012 ions cm−2, the barrier height was observed to decrease from 0.26 to 0.16eV. The reduction in barrier height correlated well with the boronconcentration found at or near the PtSi-Si interface.

2002 ◽  
Vol 716 ◽  
Author(s):  
K.L. Ng ◽  
N. Zhan ◽  
M.C. Poon ◽  
C.W. Kok ◽  
M. Chan ◽  
...  

AbstractHfO2 as a dielectric material in MOS capacitor by direct sputtering of Hf in an O2 ambient onto a Si substrate was studied. The results showed that the interface layer formed between HfO2 and the Si substrate was affected by the RTA time in the 500°C annealing temperature. Since the interface layer is mainly composed of hafnium silicate, and has high interface trap density, the effective barrier height is therefore lowered with increased RTA time. The change in the effective barrier height will affect the FN tunneling current and the operation of the MOS devices when it is applied for nonvolatile memory devices.


2005 ◽  
Vol 49 (4) ◽  
pp. 606-611 ◽  
Author(s):  
Guo-Ping Ru ◽  
R.L. Van Meirhaeghe ◽  
S. Forment ◽  
Yu-Long Jiang ◽  
Xin-Ping Qu ◽  
...  

1993 ◽  
Vol 62 (16) ◽  
pp. 1964-1966 ◽  
Author(s):  
Yasunari Umemoto ◽  
William J. Schaff ◽  
Hyunchang Park ◽  
Lester F. Eastman

2015 ◽  
Vol 33 (3) ◽  
pp. 593-600 ◽  
Author(s):  
Ömer Güllü ◽  
Abdulmecit Türüt

Abstract In this work, we prepared an ideal Cu/DNA/n-InP biopolymer-inorganic Schottky sandwich device formed by coating a n- lP semiconductor wafer with a biopolymer DNA. The Cu/DNA/n-InP contact showed a good rectifying behavior. The ideality factor value of 1.08 and the barrier height (Φb) value of 0.70 eV for the Cu/DNA/n-InP device were determined from the forward ias I-V characteristics. It was seen that the Φb value of 0.70 eV obtained for the Cu/DNA/n-InP contact was significantly larger tan the value of 0.48 eV of conventional Cu/n-InP Schottky diodes. Modification of the interfacial potential barrier of Cu/n-InP iode was achieved using a thin interlayer of DNA biopolymer. This was attributed to the fact that DNA biopolymer interlayer increased the effective barrier height by influencing the space charge region of InP.


Author(s):  
Sebastian Kozuch ◽  
Tim Schleif ◽  
Amir Karton

Quantum tunnelling can lower the effective barrier height, creating a discrepancy between experiment and theory.


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