Rodrigues-Frank Space Representations of Fiber Texture

1995 ◽  
Vol 403 ◽  
Author(s):  
Krishna Rajan ◽  
Ronald Petkie
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Crystallographic Orientation ◽  
Fiber Texture ◽  
Boundary Structure ◽  
Structure Information ◽  
Grain Boundary Structure ◽  
Specific Determination

AbstractThe concept of fcc fiber texture is examined in the context of Rodrigues-Frank (R-F) representations. Using fiber texture in thin films as the basis of our analysis, it is shown that this approach when combined with grain specific determination of crystallographic orientation provides a useful means of detecting a number of texture components with relatively small grain sampling densities. The application of R-F representations is also shown to be a useful methodology to couple grain boundary structure information with microtexture data.

Grain-boundary structure of thin films of YBa2Cu3O7 and Bi2Sr2CaCu2O8 on bicrystalline substrates

1994 ◽  
Vol 231 (1-2) ◽  
pp. 123-130 ◽  
Author(s):  
B. Kabius ◽  
J.W. Seo ◽  
T. Amrein ◽  
U. Dähne ◽  
A. Scholen ◽  
...  
Keyword(s):  
Thin Films ◽  
Grain Boundary ◽  
Boundary Structure ◽  
Grain Boundary Structure

Effects of elastic anisotropy on CTEM dislocation images in L10 alloys: An assessment of the sensitivity computed images to input parameters

1992 ◽  
Vol 50 (2) ◽  
pp. 1438-1439
Author(s):  
Abha Singh ◽  
A.H. King
Keyword(s):  
Grain Boundary ◽  
Image Matching ◽  
Elastic Anisotropy ◽  
Boundary Structure ◽  
Practical Applications ◽  
Grain Boundary Structure ◽  
Ordered Alloys ◽  
Grain Boundary Embrittlement ◽  
Matching Techniques

Ordered alloys have important applications as high temperature structural materials. Grain boundary embrittlement, however, is a major obstacle in their practical applications. The details of grain boundary structure have been suggested to be important in determining the mechanical properties, and it is therefore important to have a better understanding of grain boundary structure in these alloys.Conventional g.b and g.b×U techniques for the determination of Burgers vectors of lattice and grain boundary dislocations are limited by the magnitude of the Burgers vectors and spacing of the dislocations. The dislocations may not be detected if the magnitude of the Burgers vectors is less than 0.05nm or the spacings less than one third of the extinction distance. The strengths of grain boundary dislocations are usually very small, therefore in determining the Burgers vectors of grain boundary dislocations, computer image matching techniques are generally used in conjunction with the usual g.b and g.b×U techniques.

Interconnect Failure Dependence on Crystallographic Structure

1996 ◽  
Author(s):  
D.P. Field ◽  
J.A. Nucci ◽  
R.R. Keller
Keyword(s):  
Grain Boundary ◽  
Void Formation ◽  
Fiber Texture ◽  
Electron Back Scatter Diffraction ◽  
Boundary Structure ◽  
Experimental Fact ◽  
Crystallographic Structure ◽  
Orientation Imaging ◽  
Grain Boundary Structure ◽  
Interconnect Reliability

Abstract A wealth of literature has arisen in the past couple of decades regarding the phenomenon of electromigration. In addition, stress voiding has received considerable attention from the research community. Some of the work on the structural character of these phenomena has focussed on the roles of crystallographic texture and grain boundary structure. It is an experimental fact that the strength of the (111) fiber texture is an indication of interconnect reliability, the stronger the texture, the more reliable the interconnect. It is also presumed that grain boundary diffusivity is a controlling factor in electromigration behavior of polycrystalline lines. Undesirable grain boundary structure is likely a cause of failure in lines with a bamboo structure as well because they are often sites of stress concentration and local incompatibilities. The present study focuses upon electromigration failures in test structures of Al-Cu lines and stress voiding in Cu lines. Texture and grain boundary structure were measured directly on the specimens using electron back-scatter diffraction and orientation imaging. It is observed that a correlation exists between grain boundary structure and void formation in strongly textured polycrystalline lines. Results indicate that secondary orientation (not just the (111) fiber), and boundary structure may be of primary importance in optimizing interconnect microstructure.

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