interconnect reliability Recently Published Documents

The role of a nonconductive film (NCF) on Cu/Ni/Sn-Ag microbump interconnect reliability

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-020-04115-x ◽

2020 ◽

Vol 31 (18) ◽

pp. 15530-15538

Author(s):

Hyodong Ryu ◽

Kirak Son ◽

Jeong Sam Han ◽

Young-Bae Park ◽

Tae-Kyu Lee

Keyword(s):

2020 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA) ◽

Enhancing Interconnect Reliability and Performance by 2D Materials

10.1109/vlsi-tsa48913.2020.9203726 ◽

2020 ◽

Author(s):

Zhihong Chen

Keyword(s):

2D Materials ◽

And Performance

2020 IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS) ◽

Application of Broadband RF Metrology to Integrated Circuit Interconnect Reliability Analyses: Monitoring Copper Interconnect Corrosion in 3D-ICs

10.1109/icmts48187.2020.9107926 ◽

2020 ◽

Author(s):

Papa K. Amoah ◽

Jesus Perez ◽

Yaw S. Obeng

Keyword(s):

Integrated Circuit ◽

Copper Interconnect ◽

3D Ics ◽

Improving Copper Interconnect Reliability via Ta/Ti Based Barrier

ECS Transactions ◽

10.1149/1.3567672 ◽

2019 ◽

Vol 34 (1) ◽

pp. 775-780

Author(s):

Xiao-Wen Hu ◽

Paulchang Lin ◽

Jenny Ma ◽

Jian-Yong Jiang ◽

Peng He

Keyword(s):

Copper Interconnect ◽

Enhancing Interconnect Reliability and Performance by Converting Tantalum to 2D Layered Tantalum Sulfide at Low Temperature

Advanced Materials ◽

10.1002/adma.201902397 ◽

2019 ◽

pp. 1902397 ◽

Cited By ~ 4

Author(s):

Chun‐Li Lo ◽

Massimo Catalano ◽

Ava Khosravi ◽

Wanying Ge ◽

Yujin Ji ◽

...

Keyword(s):

Low Temperature ◽

Tantalum Sulfide ◽

And Performance

Interconnect Reliability of Low Temperature Solder for Potential Application in Enterprise Computers, Portable, and Automotive Electronics

2018 19th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2018.8480825 ◽

2018 ◽

Cited By ~ 1

Author(s):

Paul Wang ◽

David He ◽

Vivi Cao ◽

Goterry Mai ◽

Sy Song ◽

...

Keyword(s):

Low Temperature ◽

Potential Application ◽

Automotive Electronics ◽

Pathfinding of Ru-Liner/Cu-Reflow Interconnect Reliability Solution

2018 IEEE International Interconnect Technology Conference (IITC) ◽

10.1109/iitc.2018.8430464 ◽

2018 ◽

Author(s):

Zhiyuan Wu ◽

Feng Chen ◽

Gang Shen ◽

Yufei Hu ◽

Shirish Pethe ◽

...

Keyword(s):

Improve Interconnect Reliability of BGA Substrate with Stacked Vias by Reducing Carbon Inclusion in the Interface Between Via and Land Pad

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00031 ◽

2018 ◽

Cited By ~ 1

Author(s):

Kejun Zeng ◽

Jaimal Williamson

Keyword(s):

Carbon Inclusion

Interconnect reliability analysis for a 26–40 GHz 1-watt stacked GaAs pHEMT power amplifier design

2018 IEEE MTT-S International Wireless Symposium (IWS) ◽

10.1109/ieee-iws.2018.8400894 ◽

2018 ◽

Cited By ~ 2

Author(s):

Qian Lin ◽

Lin Zhu ◽

Haifeng Wu

Keyword(s):

Reliability Analysis ◽

Power Amplifier ◽

Amplifier Design