Fabrication And Characterization Of Polyimide Waveguides For Optical Interconnection

1995 ◽  
Vol 413 ◽  
Author(s):  
L. Robitaille ◽  
C. L. Callender ◽  
J. P. Noad
Keyword(s):  
Integrated Circuits ◽  
Optical Signal ◽  
Radius Of Curvature ◽  
Optical Interconnection ◽  
Low Loss ◽  
Signal Distribution ◽  
Optoelectronic Integrated Circuits ◽  
Fabrication And Characterization ◽  
On Chip

ABSTRACTThis paper reports the fabrication and characterization of polyimide branching waveguides for on-chip optical signal distribution in GaAs-based optoelectronic integrated circuits (OEICs). Low-loss polyimide s-bends and splitters with good splitting ratios and angles considerably larger than similar structures made from inorganic (e.g. LiNbO3) and semiconductor (e.g. GaAs, InP) materials, have been successfully fabricated and tested. The effects of the radius of curvature, splitter angle and cladding materials on the optical losses are discussed.

Fabrication and Characterization of Low-Loss, Sol-Gel Planar Waveguides

1994 ◽  
Vol 66 (8) ◽  
pp. 1254-1263 ◽  
Author(s):  
Lin. Yang ◽  
S. Scott. Saavedra ◽  
Neal R. Armstrong ◽  
John. Hayes
Keyword(s):  
Sol Gel ◽  
Planar Waveguides ◽  
Low Loss ◽  
Fabrication And Characterization

scholarly journals Photonic welding points for arbitrary on-chip optical interconnects

Nanophotonics ◽  
2018 ◽  
Vol 7 (10) ◽  
pp. 1679-1686 ◽  
Author(s):  
Zejie Yu ◽  
Yang Ma ◽  
Xiankai Sun
Keyword(s):  
Integrated Circuits ◽  
Low Loss ◽  
Photonic Networks ◽  
New Approach ◽  
Waveguide Bends ◽  
Arbitrary Configuration ◽  
Integration Density ◽  
On Chip ◽  
Insertion Losses ◽  
Further Development

AbstractPhotonic integrated circuits (PICs) are an ideal platform for chip-scale computation and communication. To date, the integration density remains an outstanding problem that limits the further development of PIC-based photonic networks. Achieving low-loss waveguide routing with arbitrary configuration is crucial for both classical and quantum photonic applications. To manipulate light flows on a chip, the conventional wisdom relies on waveguide bends of large bending radii and adiabatic mode converters to avoid insertion losses from radiation leakage and modal mismatch, respectively. However, those structures usually occupy large footprints and thus reduce the integration density. To overcome this difficulty, this work presents a fundamentally new approach to turn light flows arbitrarily within an ultracompact footprint. A type of “photonic welding points” joining two waveguides of an arbitrary intersecting angle has been proposed and experimentally demonstrated. These devices with a footprint of less than 4 μm2can operate in the telecommunication band over a bandwidth of at least 140 nm with an insertion loss of less than 0.5 dB. Their fabrication is compatible with photonic foundry processes and does not introduce additional steps beyond those needed for the waveguides. Therefore, they are suitable for the mass production of PICs and will enhance the integration density to the next level.

Analysis, Design, Modeling, and Characterization of Low-Loss Scalable On-Chip Transformers

2013 ◽  
Vol 61 (7) ◽  
pp. 2545-2557 ◽  
Author(s):  
Luuk F. Tiemeijer ◽  
Ralf M. T. Pijper ◽  
Cristian Andrei ◽  
Emmanuel Grenados
Keyword(s):  
Low Loss ◽  
Analysis Design ◽  
On Chip

High-speed 4x4 optoelectronic switch with on-chip optical signal distribution

1998 ◽  
Author(s):  
Carlos Almeida ◽  
Francois L. Gouin ◽  
Lucie Robitaille ◽  
Claire L. Callender ◽  
Julian P. Noad
Keyword(s):  
High Speed ◽  
Optical Signal ◽  
Signal Distribution ◽  
On Chip ◽  
Optoelectronic Switch
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